AMD Xilinx
XC2V2000-5BG575C
XC2V2000-5BG575C ECAD Model
XC2V2000-5BG575C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 408 | |
| Number of Outputs | 408 | |
| Number of Logic Cells | 24192 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B575 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Terminals | 575 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA575,24X24,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575 | |
| Pin Count | 575 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V2000-5BG575C Datasheet Download
XC2V2000-5BG575C Overview
The chip model XC2V2000-5BG575C is an advanced FPGA (Field Programmable Gate Array) manufactured by Xilinx. It is designed to provide high performance, low power consumption, and a wide variety of I/O options. It is a highly versatile device capable of being used in a variety of applications, including communications, networking, and embedded systems.
The XC2V2000-5BG575C is designed with a high-performance 5Gbps transceiver and a wide range of memory resources, allowing for high-speed data transfer and storage. It also includes a wide range of configurable logic blocks, allowing for flexible and efficient designs. Additionally, it includes a variety of I/O options, including USB, Ethernet, PCIe, and more, making it suitable for a variety of applications.
In terms of industry trends, the XC2V2000-5BG575C is well-suited for the current 5G wireless communication networks. It is also suitable for use in advanced communication systems, such as 4G and 5G wireless communication networks. Additionally, it is capable of being used in the future development of advanced communication systems, such as 6G and beyond.
The XC2V2000-5BG575C is also well-suited for use in intelligent systems, such as autonomous vehicles, robotics, and artificial intelligence. It is capable of being used in intelligent networks, allowing for high-speed data transfer and storage. Additionally, it is capable of being used in intelligent scenarios, such as facial recognition, object recognition, and natural language processing.
In terms of future upgrades, the XC2V2000-5BG575C is capable of being upgraded to higher performance levels. It is also capable of being used in the era of fully intelligent systems, such as the Internet of Things (IoT). Additionally, it can be used to support new technologies, such as quantum computing, which require high-speed data transfer and processing.
In conclusion, the XC2V2000-5BG575C is a highly versatile and powerful chip model that is capable of being used in a variety of applications. It is well-suited for use in the current 5G wireless communication networks, as well as for advanced communication systems, such as 4G and 5G. Additionally, it can be used in intelligent systems, such as autonomous vehicles, robotics, and artificial intelligence. Finally, it is capable of being upgraded to higher performance levels, and it can be used to support new technologies, such as quantum computing.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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