AMD Xilinx
XC2V2000-6BFG957C
XC2V2000-6BFG957C ECAD Model
XC2V2000-6BFG957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2V2000-6BFG957C Datasheet Download
XC2V2000-6BFG957C Overview
The XC2V2000-6BFG957C chip model is a powerful and versatile device designed for high-performance digital signal processing, embedded processing, and image processing. It is a field-programmable gate array (FPGA) device with a Virtex-II 2000 architecture and 6 million gates, making it suitable for a wide variety of applications.
The device is capable of handling complex tasks that require the use of the hardware description language (HDL). This language allows the user to design and program the device to perform specific tasks. The device is also capable of being used in a networked environment and can be used to build intelligent systems.
The product description of the XC2V2000-6BFG957C chip model includes its Virtex-II 2000 architecture, 6 million gates, and its ability to handle complex tasks. The device is capable of being used in a network and can be used to build intelligent systems. The user should take into consideration the specific design requirements of the device, such as the power requirements, the clock speed, and the number of pins.
In addition to the product description, actual case studies can provide the user with an understanding of how the device can be used in a real-world application. For example, the device can be used to create an embedded system for a security system, with the user able to program the device to detect motion and alert the user.
When using the XC2V2000-6BFG957C chip model, the user should also take into consideration the precautions that must be taken. This includes ensuring that the device is properly powered, that the clock speed is set correctly, and that the number of pins is not exceeded. Additionally, the user should make sure that the HDL is properly written to ensure that the device functions as expected.
In conclusion, the XC2V2000-6BFG957C chip model is a powerful and versatile device designed for high-performance digital signal processing, embedded processing, and image processing. It is capable of being used in a networked environment and can be used to build intelligent systems. The user should take into consideration the product description and specific design requirements of the device, as well as actual case studies and precautions, when using the device.
You May Also Be Interested In
1,114 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||