AMD Xilinx
XC2V2000-6BF957C
XC2V2000-6BF957C ECAD Model
XC2V2000-6BF957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 24192 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2V2000-6BF957C Datasheet Download
XC2V2000-6BF957C Overview
The XC2V2000-6BF957C chip model is a highly advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is an ideal choice for applications that require the use of HDL language, such as network and intelligent scenarios.
The XC2V2000-6BF957C chip model is capable of handling complex tasks and can be used in the era of fully intelligent systems. It is also suitable for developing and popularizing future intelligent robots, as it provides the necessary processing power and robustness to handle the most demanding tasks. Additionally, the chip model is equipped with a range of features, such as low power consumption and high speed, making it a suitable choice for a wide range of applications.
To use the XC2V2000-6BF957C chip model effectively, technical talents such as experienced HDL language programmers, embedded systems engineers, and digital signal processing experts are needed. These professionals should be familiar with the chip model’s architecture and features, as well as the applications it is designed for. Additionally, they should have a good understanding of the development environment, such as the hardware and software platforms, as well as the hardware and software tools available.
In conclusion, the XC2V2000-6BF957C chip model is a powerful and reliable integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is suitable for a wide range of applications, including network and intelligent scenarios, and can be used in the era of fully intelligent systems. Additionally, it is suitable for developing and popularizing future intelligent robots, and experienced technical talents are needed to use the chip model effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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