AMD Xilinx
XC2V2000-5BF957C
XC2V2000-5BF957C ECAD Model
XC2V2000-5BF957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 24192 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V2000-5BF957C Datasheet Download
XC2V2000-5BF957C Overview
The XC2V2000-5BF957C chip model is a high-performance, low-power FPGA from Xilinx. It is designed to provide users with an efficient and reliable solution for their embedded system needs. The chip model features a wide range of features, including a high-speed, low-power, logic-optimized architecture, as well as a comprehensive set of features for embedded system applications.
The XC2V2000-5BF957C chip model is designed to meet the needs of advanced communication systems. It is capable of providing high-speed data transmission and receiving at low power consumption. It also supports various communication protocols, such as Ethernet, USB, and Wi-Fi. Furthermore, the chip model is designed to be easily upgradable, allowing users to upgrade their systems with the latest technology.
The XC2V2000-5BF957C chip model can be used in various intelligent scenarios, such as autonomous driving, image processing, and voice recognition. It is also capable of providing high-quality data transmission and receiving, which is essential for the development of intelligent systems. Furthermore, the chip model is designed to be compatible with the latest technologies, allowing users to keep up with the latest trends.
The XC2V2000-5BF957C chip model is designed with specific requirements in mind. It is designed to provide users with a reliable and efficient solution for their embedded system needs. The chip model features a wide range of features, including a high-speed, low-power, logic-optimized architecture, as well as a comprehensive set of features for embedded system applications. Furthermore, the chip model also features a wide range of safety features, such as ECC and parity check, to ensure the security of the system.
In order to ensure that users are able to make the most out of the chip model, actual case studies and precautions should be taken into consideration. For example, users should always make sure that they are using the latest version of the chip model, as well as making sure that their system is able to meet the requirements of the chip model. Furthermore, users should also ensure that they are using the correct power supply to avoid any potential damage to the chip model.
In conclusion, the XC2V2000-5BF957C chip model is a high-performance, low-power FPGA from Xilinx. It is designed to provide users with an efficient and reliable solution for their embedded system needs. The chip model is capable of providing high-speed data transmission and receiving at low power consumption, and is also designed to be easily upgradable. Furthermore, the chip model can be used in various intelligent scenarios, such as autonomous driving, image processing, and voice recognition. Finally, users should always take the necessary precautions and case studies into consideration when using the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||