AMD Xilinx
XC2V2000-4BFG957C
XC2V2000-4BFG957C ECAD Model
XC2V2000-4BFG957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V2000-4BFG957C Datasheet Download
XC2V2000-4BFG957C Overview
The chip model XC2V2000-4BFG957C is an advanced technology that has been developed to meet the needs of the ever-changing technology industry. This model is designed to provide an efficient and reliable solution to communication systems and other related industries. It is a powerful and versatile chip model that can be used in a variety of applications.
The XC2V2000-4BFG957C chip model offers a number of advantages over other chip models. It is capable of providing high-speed data transmission, which makes it suitable for applications that require high-speed communication. It also offers a low power consumption, which makes it ideal for applications that require low power consumption. Additionally, the XC2V2000-4BFG957C chip model is designed to be compatible with a wide range of communication systems, making it a very versatile chip model.
In terms of the future development of related industries, the XC2V2000-4BFG957C chip model is expected to remain popular due to its versatility and efficiency. As the demand for high-speed communication increases, this chip model will become even more popular. As the technology industry advances, new technologies will be needed to support the application environment. The XC2V2000-4BFG957C chip model is designed to be able to integrate with new technologies, making it a good choice for future applications.
The original design intention of the XC2V2000-4BFG957C chip model was to provide an efficient and reliable solution to communication systems and other related industries. This chip model was designed to be compatible with a wide range of communication systems and to be able to integrate with new technologies. It is also designed to be able to handle high-speed data transmission, making it suitable for applications that require high-speed communication.
In terms of future upgrades, the XC2V2000-4BFG957C chip model is designed to be able to integrate with new technologies. This means that it can be used in applications that require support for new technologies. Additionally, the chip model is also designed to be able to handle high-speed data transmission, making it suitable for applications that require high-speed communication.
Overall, the XC2V2000-4BFG957C chip model is a powerful and versatile chip model that is designed to provide an efficient and reliable solution to communication systems and other related industries. It is capable of providing high-speed data transmission, which makes it suitable for applications that require high-speed communication. Additionally, the chip model is designed to be able to integrate with new technologies, making it a good choice for future applications. As the technology industry advances, the demand for this chip model is expected to remain high due to its versatility and efficiency.
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