AMD Xilinx
XC2V1500-4BG575C
XC2V1500-4BG575C ECAD Model
XC2V1500-4BG575C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 392 | |
| Number of Outputs | 392 | |
| Number of Logic Cells | 17280 | |
| Number of Equivalent Gates | 1500000 | |
| Number of CLBs | 1920 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1920 CLBS, 1500000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B575 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Terminals | 575 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA575,24X24,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575 | |
| Pin Count | 575 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V1500-4BG575C Datasheet Download
XC2V1500-4BG575C Overview
The XC2V1500-4BG575C chip model is a high-performance, low-cost, and low-power FPGA solution from Xilinx. It is designed to meet the needs of a wide range of applications, from industrial automation to consumer and automotive electronics. This model is ideal for applications that require high-performance and low-cost solutions.
The XC2V1500-4BG575C chip model has several advantages. It offers a high-performance, low-power, and low-cost solution with a large number of configurable I/O pins and memory blocks. It also has an integrated clock management unit, which can be used to reduce the number of external clock sources and simplify the design process. In addition, the chip model has a wide range of applications, including high-speed data transfer, video processing, and image processing.
The demand for the XC2V1500-4BG575C chip model is expected to grow in the future, especially in the fields of industrial automation, consumer electronics, and automotive electronics. This model is suitable for a variety of applications, such as high-speed data transfer, video processing, and image processing. As the demand for these applications increases, the demand for the XC2V1500-4BG575C chip model will also increase.
The original design intention of the XC2V1500-4BG575C chip model was to provide a high-performance, low-cost, and low-power FPGA solution. The model has been designed to meet the needs of a wide range of applications. It is expected that the chip model will be upgraded in the future to meet the needs of more advanced applications. The chip model is also expected to be used in the development and popularization of future intelligent robots.
The XC2V1500-4BG575C chip model can be effectively used by technical personnel with knowledge of embedded systems, digital signal processing, and FPGA design. The chip model can also be used by engineers with knowledge of computer architecture and embedded programming. Additionally, the chip model can be used by engineers with knowledge of analog and digital electronics.
In conclusion, the XC2V1500-4BG575C chip model is a high-performance, low-cost, and low-power FPGA solution from Xilinx. It has several advantages, such as a large number of configurable I/O pins and memory blocks, as well as an integrated clock management unit. The demand for the XC2V1500-4BG575C chip model is expected to grow in the future, especially in the fields of industrial automation, consumer electronics, and automotive electronics. The chip model is also expected to be used in the development and popularization of future intelligent robots. Technical personnel with knowledge of embedded systems, digital signal processing, FPGA design, computer architecture, embedded programming, analog and digital electronics can use the chip model effectively.
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5,546 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $377.4522 | $377.4522 |
| 10+ | $373.3936 | $3,733.9359 |
| 100+ | $353.1005 | $35,310.0462 |
| 1000+ | $332.8073 | $166,403.6660 |
| 10000+ | $304.3970 | $304,396.9500 |
| The price is for reference only, please refer to the actual quotation! | ||