AMD Xilinx
XC2V1000-6BG575C
XC2V1000-6BG575C ECAD Model
XC2V1000-6BG575C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 328 | |
| Number of Outputs | 328 | |
| Number of Logic Cells | 11520 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B575 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Terminals | 575 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA575,24X24,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575 | |
| Pin Count | 575 | |
| ECCN Code | 3A991.D |
XC2V1000-6BG575C Datasheet Download
XC2V1000-6BG575C Overview
The XC2V1000-6BG575C chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, making it a great choice for those looking for a high-performance solution for their projects.
In the era of fully intelligent systems, the XC2V1000-6BG575C chip model has the potential to be used in a variety of applications. It can be used in networks to improve communication and data processing speeds, as well as to process and analyze large volumes of data. It can also be used to develop and popularize future intelligent robots, as its powerful processing capabilities can help robots understand and respond to their environment.
In order to use the XC2V1000-6BG575C chip model effectively, technical talents such as software engineers and hardware engineers are needed. Software engineers are needed to write the code for the chip model, while hardware engineers are needed to design the circuit boards and other components that the chip model will be used in. Additionally, those with a good understanding of HDL language will be better able to take advantage of the chip model's capabilities.
Overall, the XC2V1000-6BG575C chip model is a powerful and versatile tool that can be used in a variety of applications. With the right technical talents and a good understanding of HDL language, it can be used to create intelligent networks and robots, as well as to process and analyze large volumes of data.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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