
AMD Xilinx
XCV50-6BG256I
XCV50-6BG256I ECAD Model
XCV50-6BG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 180 | |
Number of Outputs | 180 | |
Number of Logic Cells | 1728 | |
Number of Equivalent Gates | 57906 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 384 CLBS, 57906 GATES | |
Clock Frequency-Max | 333 MHz | |
Power Supplies | 1.2/3.6,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,20X20,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCV50-6BG256I Datasheet Download
XCV50-6BG256I Overview
The XCV50-6BG256I chip model is a powerful piece of technology designed to meet the needs of a wide range of applications. It is a multi-functional, multi-core processor that is capable of performing numerous calculations in a fraction of a second. This makes it an ideal choice for a variety of applications, ranging from communication systems to advanced robotics.
The original design intention of the XCV50-6BG256I chip model was to provide a powerful, versatile platform for a variety of applications. Its multi-core processor allows it to perform complex calculations quickly and accurately, and its integrated memory and storage capabilities make it an ideal choice for network applications. It is also capable of running multiple operating systems, making it suitable for a wide range of scenarios.
The XCV50-6BG256I chip model is also capable of being upgraded in the future. It can be adapted to the ever-evolving needs of the industry, and its integrated hardware and software components can be upgraded to meet the requirements of the latest technologies. This makes it an ideal choice for a variety of applications, ranging from communication systems to advanced robotics.
The XCV50-6BG256I chip model can also be used in the era of fully intelligent systems. Its powerful processor and integrated memory and storage capabilities make it an ideal choice for a variety of intelligent scenarios. It can be used to develop and popularize future intelligent robots, and its multi-core processor allows it to process large amounts of data quickly and accurately.
In order to use the XCV50-6BG256I chip model effectively, it is necessary to have a strong technical background. The chip model requires a deep understanding of its hardware and software components in order to be used to its full potential. It also requires knowledge of programming languages, as well as an understanding of the various algorithms and techniques used in the development of intelligent robots. With the right technical expertise, the XCV50-6BG256I chip model can be used to its full potential and provide a powerful platform for the development and popularization of future intelligent robots.
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4,682 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $99.1603 | $99.1603 |
10+ | $98.0941 | $980.9408 |
100+ | $92.7629 | $9,276.2880 |
1000+ | $87.4317 | $43,715.8400 |
10000+ | $79.9680 | $79,968.0000 |
The price is for reference only, please refer to the actual quotation! |