XCV50-6BG256I
XCV50-6BG256I
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rohs

AMD Xilinx

XCV50-6BG256I


XCV50-6BG256I
F20-XCV50-6BG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-256
BGA-256

XCV50-6BG256I ECAD Model


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XCV50-6BG256I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Inputs 180
Number of Outputs 180
Number of Logic Cells 1728
Number of Equivalent Gates 57906
Number of CLBs 384
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 384 CLBS, 57906 GATES
Clock Frequency-Max 333 MHz
Power Supplies 1.2/3.6,2.5 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCV50-6BG256I Datasheet Download


XCV50-6BG256I Overview



The XCV50-6BG256I chip model is a powerful piece of technology designed to meet the needs of a wide range of applications. It is a multi-functional, multi-core processor that is capable of performing numerous calculations in a fraction of a second. This makes it an ideal choice for a variety of applications, ranging from communication systems to advanced robotics.


The original design intention of the XCV50-6BG256I chip model was to provide a powerful, versatile platform for a variety of applications. Its multi-core processor allows it to perform complex calculations quickly and accurately, and its integrated memory and storage capabilities make it an ideal choice for network applications. It is also capable of running multiple operating systems, making it suitable for a wide range of scenarios.


The XCV50-6BG256I chip model is also capable of being upgraded in the future. It can be adapted to the ever-evolving needs of the industry, and its integrated hardware and software components can be upgraded to meet the requirements of the latest technologies. This makes it an ideal choice for a variety of applications, ranging from communication systems to advanced robotics.


The XCV50-6BG256I chip model can also be used in the era of fully intelligent systems. Its powerful processor and integrated memory and storage capabilities make it an ideal choice for a variety of intelligent scenarios. It can be used to develop and popularize future intelligent robots, and its multi-core processor allows it to process large amounts of data quickly and accurately.


In order to use the XCV50-6BG256I chip model effectively, it is necessary to have a strong technical background. The chip model requires a deep understanding of its hardware and software components in order to be used to its full potential. It also requires knowledge of programming languages, as well as an understanding of the various algorithms and techniques used in the development of intelligent robots. With the right technical expertise, the XCV50-6BG256I chip model can be used to its full potential and provide a powerful platform for the development and popularization of future intelligent robots.



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Unit Price: $106.624
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Pricing (USD)

QTY Unit Price Ext Price
1+ $99.1603 $99.1603
10+ $98.0941 $980.9408
100+ $92.7629 $9,276.2880
1000+ $87.4317 $43,715.8400
10000+ $79.9680 $79,968.0000
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