
AMD Xilinx
XC3S200-5FT256I
XC3S200-5FT256I ECAD Model
XC3S200-5FT256I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Number of Inputs | 173 | |
Number of Outputs | 173 | |
Number of Logic Cells | 4320 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC3S200-5FT256I Datasheet Download
XC3S200-5FT256I Overview
The XC3S200-5FT256I chip model is a high-performance, low-cost FPGA (Field Programmable Gate Array) manufactured by Xilinx. It is designed to meet the needs of a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. The chip model is a versatile solution that is easy to use and can be configured to meet the needs of any project.
The original design intention of the XC3S200-5FT256I chip model was to provide a cost-effective solution for users who need to implement complex designs. It is also capable of being upgraded, allowing users to expand their designs and capabilities as needed. The chip model is also suitable for use in advanced communication systems, as it is capable of supporting the necessary protocols and data rates.
The XC3S200-5FT256I chip model can also be used for the development and popularization of future intelligent robots. It is powerful enough to support the necessary algorithms and hardware configurations needed to create robots with advanced capabilities. To use the chip model effectively, users need to have a good understanding of HDL (Hardware Description Language) programming. This language is used to create the logic and configurations that control the chip model’s behavior.
In conclusion, the XC3S200-5FT256I chip model is a versatile and cost-effective solution for users who need to implement complex designs. It is capable of being upgraded, and can be used for advanced communication systems and the development and popularization of future intelligent robots. To use the chip model effectively, users need to have a good understanding of HDL programming.
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