AMD Xilinx
XCV150-6BG256I
XCV150-6BG256I ECAD Model
XCV150-6BG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 180 | |
| Number of Outputs | 180 | |
| Number of Logic Cells | 3888 | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-6BG256I Datasheet Download
XCV150-6BG256I Overview
The chip model XCV150-6BG256I is a high-performance digital signal processor designed for embedded processing, image processing, and other applications. It is designed to work with the HDL (Hardware Description Language) language, making it a powerful tool for those looking to create complex systems.
The XCV150-6BG256I is a unique chip model that offers a wide range of features and capabilities. It is capable of performing complex calculations quickly and accurately, making it ideal for high-performance digital signal processing. Furthermore, its ability to be programmed in HDL makes it even more versatile, allowing for the creation of complex systems.
In terms of industry trends, the XCV150-6BG256I is a chip model that is well-suited to the current market. It is a highly-capable processor that is capable of meeting the demands of modern applications. Furthermore, its ability to be programmed in HDL makes it a great choice for those looking to create advanced communication systems.
The original design intention of the XCV150-6BG256I was to create a powerful processor that could meet the needs of modern applications. It has since become a popular choice for those looking to create complex systems. As the chip model continues to evolve, it is likely that it will be capable of performing even more complex tasks in the future.
In terms of the application environment, the XCV150-6BG256I is capable of working with a variety of technologies. It is compatible with a wide range of operating systems and can be used in conjunction with a variety of hardware. Furthermore, its ability to be programmed in HDL makes it a great choice for those looking to create advanced communication systems.
Overall, the chip model XCV150-6BG256I is a powerful processor that is capable of meeting the demands of modern applications. Its ability to be programmed in HDL makes it an ideal choice for those looking to create complex systems. Furthermore, its compatibility with a wide range of technologies makes it a great choice for those looking to create advanced communication systems. As the chip model continues to evolve, it is likely that it will be capable of performing even more complex tasks in the future.
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