AMD Xilinx
XCV100-6BG256I
XCV100-6BG256I ECAD Model
XCV100-6BG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 180 | |
| Number of Outputs | 180 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 108904 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 108904 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.5/3.3,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV100-6BG256I Datasheet Download
XCV100-6BG256I Overview
The XCV100-6BG256I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for a wide range of applications. With its ability to handle complex tasks, the XCV100-6BG256I is well-suited for use in various industries, such as telecommunications, automotive, and medical.
The industry trends of the XCV100-6BG256I chip model are constantly changing as new technologies are developed and adopted. It is important to be aware of the latest developments in the field of digital signal processing, embedded processing, and image processing, so that the XCV100-6BG256I chip model can be used to its fullest potential. As new technologies are adopted, the XCV100-6BG256I chip model can be used in more advanced applications, such as networks and intelligent systems.
The XCV100-6BG256I chip model is well-suited for use in networks and intelligent systems. It can be used to process large amounts of data quickly and efficiently, making it ideal for use in the era of fully intelligent systems. The chip model is also capable of handling complex tasks, making it a valuable tool for network security and data analysis.
In conclusion, the XCV100-6BG256I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for a wide range of applications. As new technologies are developed and adopted, the XCV100-6BG256I chip model can be used in more advanced applications, such as networks and intelligent systems. This makes it an invaluable tool for the future of digital signal processing, embedded processing, and image processing.
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