XCV200-6BG256I
XCV200-6BG256I
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rohs

AMD Xilinx

XCV200-6BG256I


XCV200-6BG256I
F20-XCV200-6BG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-256
BGA-256

XCV200-6BG256I ECAD Model


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XCV200-6BG256I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Inputs 180
Number of Outputs 180
Number of Logic Cells 5292
Number of Equivalent Gates 236666
Number of CLBs 1176
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1176 CLBS, 236666 GATES
Clock Frequency-Max 333 MHz
Power Supplies 1.2/3.6,2.5 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCV200-6BG256I Datasheet Download


XCV200-6BG256I Overview



The XCV200-6BG256I chip model is an innovative product of the semiconductor industry, developed by a leading chip manufacturer. It is a high-performance, low-power, and low-cost chip model, designed to meet the needs of the network and intelligent system industry. With its advanced features, it has become a popular choice for many industries.


The XCV200-6BG256I chip model has a number of advantages over other chip models. It is capable of providing high-speed data transfer, low latency, and high-end performance. The chip model also offers a wide range of features, including support for multiple protocols, advanced security features, and a variety of integrated peripherals. Additionally, it is designed to be power-efficient and cost-effective.


The XCV200-6BG256I chip model is expected to see an increasing demand in the future, especially in the network and intelligent system industry. As the demand for intelligent systems grows, the XCV200-6BG256I chip model is likely to be used in a variety of applications. It can be used in a variety of intelligent scenarios, such as autonomous vehicles, home automation, and smart city systems. Additionally, it is likely to be used in the era of fully intelligent systems, as it is capable of providing the necessary performance and features needed for such systems.


The XCV200-6BG256I chip model has a number of design requirements, which must be met in order to ensure its performance and reliability. It must be able to support multiple protocols, have advanced security features, and have a wide range of integrated peripherals. Additionally, it must be able to provide high-speed data transfer and low latency.


There are a number of case studies and precautions that should be taken into consideration when using the XCV200-6BG256I chip model. For instance, it is important to ensure that the chip model is compatible with the hardware and software that it is intended to be used with. Additionally, it is important to ensure that the chip model is properly configured and that the appropriate security measures are taken.


In conclusion, the XCV200-6BG256I chip model is a highly advanced and powerful chip model that is capable of providing a wide range of features and performance. It is expected to be used in a variety of applications, especially in the network and intelligent system industry. It is designed to be power-efficient and cost-effective, and it must meet a variety of design requirements in order to ensure its performance and reliability. Additionally, there are a number of case studies and precautions that should be taken into consideration when using the XCV200-6BG256I chip model.



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QTY Unit Price Ext Price
1+ $171.8640 $171.8640
10+ $170.0160 $1,700.1600
100+ $160.7760 $16,077.6000
1000+ $151.5360 $75,768.0000
10000+ $138.6000 $138,600.0000
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