
AMD Xilinx
XCV200-6BG256I
XCV200-6BG256I ECAD Model
XCV200-6BG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 180 | |
Number of Outputs | 180 | |
Number of Logic Cells | 5292 | |
Number of Equivalent Gates | 236666 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 236666 GATES | |
Clock Frequency-Max | 333 MHz | |
Power Supplies | 1.2/3.6,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,20X20,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCV200-6BG256I Datasheet Download
XCV200-6BG256I Overview
The XCV200-6BG256I chip model is an innovative product of the semiconductor industry, developed by a leading chip manufacturer. It is a high-performance, low-power, and low-cost chip model, designed to meet the needs of the network and intelligent system industry. With its advanced features, it has become a popular choice for many industries.
The XCV200-6BG256I chip model has a number of advantages over other chip models. It is capable of providing high-speed data transfer, low latency, and high-end performance. The chip model also offers a wide range of features, including support for multiple protocols, advanced security features, and a variety of integrated peripherals. Additionally, it is designed to be power-efficient and cost-effective.
The XCV200-6BG256I chip model is expected to see an increasing demand in the future, especially in the network and intelligent system industry. As the demand for intelligent systems grows, the XCV200-6BG256I chip model is likely to be used in a variety of applications. It can be used in a variety of intelligent scenarios, such as autonomous vehicles, home automation, and smart city systems. Additionally, it is likely to be used in the era of fully intelligent systems, as it is capable of providing the necessary performance and features needed for such systems.
The XCV200-6BG256I chip model has a number of design requirements, which must be met in order to ensure its performance and reliability. It must be able to support multiple protocols, have advanced security features, and have a wide range of integrated peripherals. Additionally, it must be able to provide high-speed data transfer and low latency.
There are a number of case studies and precautions that should be taken into consideration when using the XCV200-6BG256I chip model. For instance, it is important to ensure that the chip model is compatible with the hardware and software that it is intended to be used with. Additionally, it is important to ensure that the chip model is properly configured and that the appropriate security measures are taken.
In conclusion, the XCV200-6BG256I chip model is a highly advanced and powerful chip model that is capable of providing a wide range of features and performance. It is expected to be used in a variety of applications, especially in the network and intelligent system industry. It is designed to be power-efficient and cost-effective, and it must meet a variety of design requirements in order to ensure its performance and reliability. Additionally, there are a number of case studies and precautions that should be taken into consideration when using the XCV200-6BG256I chip model.
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5,038 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $171.8640 | $171.8640 |
10+ | $170.0160 | $1,700.1600 |
100+ | $160.7760 | $16,077.6000 |
1000+ | $151.5360 | $75,768.0000 |
10000+ | $138.6000 | $138,600.0000 |
The price is for reference only, please refer to the actual quotation! |