AMD Xilinx
XCR3512XL-7FGG324C
XCR3512XL-7FGG324C ECAD Model
XCR3512XL-7FGG324C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 512 | |
| Number of I/O Lines | 260 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 260 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 135 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3512XL-7FGG324C Datasheet Download
XCR3512XL-7FGG324C Overview
The XCR3512XL-7FGG324C chip model is a high-performance, low-power integrated circuit specifically designed for digital signal processing, embedded processing, and image processing. This chip model is built with a modern HDL language, allowing for flexible and efficient programming. With its high-performance capabilities, the XCR3512XL-7FGG324C is suitable for a wide range of applications, from consumer electronics to medical imaging.
The chip model XCR3512XL-7FGG324C offers several advantages over other chip models, including its low power consumption, high-speed processing, and low-cost manufacturing. Furthermore, the chip model is designed to be highly compatible with existing hardware and software platforms, making it easy to integrate into existing systems. This makes the XCR3512XL-7FGG324C an ideal choice for many industries, such as automotive, healthcare, and consumer electronics.
In terms of future development, the XCR3512XL-7FGG324C is positioned to be a leading chip model in the digital signal processing industry. With its wide range of applications and its compatibility with existing hardware and software, the chip model is expected to remain a top choice for many industries. However, the demand for the XCR3512XL-7FGG324C may depend on the specific technologies needed for the application environment, as well as the industry trends of the chip model in the future.
Overall, the XCR3512XL-7FGG324C chip model is designed to be a powerful and efficient solution for digital signal processing, embedded processing, and image processing. The chip model offers low power consumption, high-speed processing, and low-cost manufacturing, making it a great choice for many industries. Furthermore, the chip model is designed to be highly compatible with existing hardware and software platforms, allowing for easy integration into existing systems. As such, the XCR3512XL-7FGG324C is expected to remain a top choice for many industries, and the demand for the chip model is likely to remain strong in the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||