AMD Xilinx
XCR3512XL-10FGG324C
XCR3512XL-10FGG324C ECAD Model
XCR3512XL-10FGG324C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 10 ns | |
| Number of Macro Cells | 512 | |
| Number of I/O Lines | 260 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 260 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 97 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3512XL-10FGG324C Datasheet Download
XCR3512XL-10FGG324C Overview
The XCR3512XL-10FGG324C chip model is a powerful, versatile and innovative semiconductor solution designed to meet the needs of the modern technology industry. It is the latest model released by the leading manufacturer in the semiconductor industry and provides a variety of features to help facilitate the development and deployment of advanced technologies.
The XCR3512XL-10FGG324C chip model is designed to provide a high performance and low power consumption solution for a wide range of applications. It features a 32-bit RISC processor core and a 10-bit ADC, which provides a high level of accuracy and precision for data processing. Additionally, the chip model is equipped with an integrated memory controller, which helps to reduce the time needed for data processing. Furthermore, the chip model also features a high-speed SPI interface and a USB interface, which allows for easy connection to a variety of external devices.
The XCR3512XL-10FGG324C chip model is expected to be in high demand in the near future, due to its versatile design and the wide range of applications it can be used for. It is suitable for use in a wide range of industries, including automotive, industrial, medical, and consumer electronics. Additionally, it is also suitable for use in the development of intelligent robots, due to its powerful processing capabilities and its ability to provide accurate and precise data processing.
In order to effectively utilize the XCR3512XL-10FGG324C chip model, technical personnel need to have a thorough understanding of the product and its features. This includes understanding the product specifications, the design requirements, and the expected performance of the chip model. Additionally, technical personnel should also be familiar with the various applications of the chip model, including the development of intelligent robots. Furthermore, personnel should also be aware of any potential risks associated with the use of the chip model, such as the potential for data loss or the risk of data corruption.
Case studies of the XCR3512XL-10FGG324C chip model have shown that it is capable of providing a high level of performance and accuracy for data processing. Additionally, the chip model has been tested in a variety of applications, including automotive, industrial, medical, and consumer electronics. The results of these tests have demonstrated that the chip model is capable of providing a reliable and efficient solution for a wide range of applications.
In conclusion, the XCR3512XL-10FGG324C chip model is a powerful, versatile and innovative semiconductor solution designed to meet the needs of the modern technology industry. It is expected to be in high demand in the near future, due to its versatile design and the wide range of applications it can be used for. Additionally, the chip model is suitable for use in the development of intelligent robots, due to its powerful processing capabilities and its ability to provide accurate and precise data processing. In order to effectively utilize the XCR3512XL-10FGG324C chip model, technical personnel need to have a thorough understanding of the product and its features, as well as the various applications of the chip model.
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5,316 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $226.5859 | $226.5859 |
| 10+ | $224.1495 | $2,241.4954 |
| 100+ | $211.9675 | $21,196.7496 |
| 1000+ | $199.7855 | $99,892.7280 |
| 10000+ | $182.7306 | $182,730.6000 |
| The price is for reference only, please refer to the actual quotation! | ||