
AMD Xilinx
XCR3384XL-7FG324C
XCR3384XL-7FG324C ECAD Model
XCR3384XL-7FG324C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Propagation Delay | 7.5 ns | |
Number of Macro Cells | 384 | |
Number of I/O Lines | 220 | |
Programmable Logic Type | EE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 220 I/O | |
Additional Feature | YES | |
Clock Frequency-Max | 135 MHz | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B324 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 324 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,20X20,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-324 | |
Pin Count | 324 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XCR3384XL-7FG324C Datasheet Download
XCR3384XL-7FG324C Overview
The chip model XCR3384XL-7FG324C is a cutting-edge model designed for modern communication systems. It has a wide range of applications and is considered to be one of the most advanced chips on the market. In particular, it is designed to be used in advanced communication systems, such as 5G networks and beyond.
The XCR3384XL-7FG324C chip model offers a number of advantages over its predecessors. It is capable of supporting a wide range of communication protocols, including Advanced Mobile Network Protocols (AMNP), which are essential for the development of 5G networks. In addition, it is capable of providing high-speed data transmission and is equipped with an advanced security system. This makes it ideal for use in a variety of communication systems, from small-scale networks to large-scale infrastructure.
The chip model is also designed to be able to be upgraded in the future. This means that it can be used in the most advanced communication systems, such as the upcoming 6G networks. In addition, its design allows for the possibility of further upgrades, such as the integration of artificial intelligence (AI) and machine learning (ML) technologies. This would enable the XCR3384XL-7FG324C chip model to be used in a variety of intelligent scenarios, such as autonomous driving, smart homes, and smart cities.
The XCR3384XL-7FG324C chip model is expected to be in high demand in the future, as more and more communication systems are being developed and deployed. As such, it is likely to be used in a variety of applications, from small-scale networks to large-scale infrastructure. In addition, its potential to be used in the era of fully intelligent systems makes it an ideal candidate for use in a variety of intelligent scenarios.
Overall, the XCR3384XL-7FG324C chip model is a cutting-edge model designed for modern communication systems. It is capable of supporting a wide range of communication protocols, providing high-speed data transmission, and is equipped with an advanced security system. It is also designed to be able to be upgraded in the future, making it ideal for use in a variety of intelligent scenarios. As such, it is expected to be in high demand in the future, and is likely to be used in a variety of applications, from small-scale networks to large-scale infrastructure.
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