AMD Xilinx
XCR3384XL-7FGG324C
XCR3384XL-7FGG324C ECAD Model
XCR3384XL-7FGG324C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 384 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 220 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 135 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3384XL-7FGG324C Datasheet Download
XCR3384XL-7FGG324C Overview
The XCR3384XL-7FGG324C is an advanced integrated circuit chip designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, allowing users to develop complex algorithms quickly and efficiently. The XCR3384XL-7FGG324C is a powerful chip that has several advantages over other chipsets.
The XCR3384XL-7FGG324C is a low-power, high-performance chip that can be used for a variety of applications. It is designed to be used with the HDL language, allowing users to develop complex algorithms quickly and efficiently. It is capable of handling large amounts of data, making it ideal for digital signal processing applications. The chip also has a low-power consumption, making it suitable for battery-operated devices. Additionally, the chip features a small form factor, making it easy to integrate into existing systems.
The XCR3384XL-7FGG324C is a powerful chip that is expected to be in high demand in various industries in the future. It is suitable for use in applications such as medical imaging, automotive, military, and aerospace. Additionally, the chip is expected to be used in consumer electronics, including smartphones, tablets, and other handheld devices.
When designing a system using the XCR3384XL-7FGG324C, it is important to consider the specific design requirements of the chip. For example, the chip requires the use of the HDL language, which may require additional software development. Additionally, the chip requires a specific power supply and clock frequency, which must be taken into account when designing the system.
When designing a system with the XCR3384XL-7FGG324C, it is important to consider the actual case studies and precautions. For example, it is important to consider the power consumption of the chip and ensure that the system is designed to be as power-efficient as possible. Additionally, it is important to consider the system's thermal design, as the chip may generate a significant amount of heat when operating at high speeds.
In conclusion, the XCR3384XL-7FGG324C is an advanced chip designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, allowing users to develop complex algorithms quickly and efficiently. Additionally, the chip is expected to be in high demand in various industries in the future. When designing a system using the XCR3384XL-7FGG324C, it is important to consider the specific design requirements of the chip and the actual case studies and precautions.
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