AMD Xilinx
XCR3512XL-12FGG324I
XCR3512XL-12FGG324I ECAD Model
XCR3512XL-12FGG324I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 12 ns | |
| Number of Macro Cells | 512 | |
| Number of I/O Lines | 260 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 260 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 77 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3/3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3512XL-12FGG324I Datasheet Download
XCR3512XL-12FGG324I Overview
The XCR3512XL-12FGG324I chip model is a highly advanced and versatile piece of technology that has been developed by Xilinx to meet the needs of a variety of industries. This chip model is capable of providing a powerful and reliable performance for a wide range of applications, and its features and capabilities make it an ideal choice for many different types of projects.
The XCR3512XL-12FGG324I chip model is designed to provide a high-performance, low-power solution for a variety of applications. It is capable of supporting a wide range of communication protocols, and its advanced features make it suitable for use in a variety of advanced communication systems. The chip model also offers a wide range of features that can be used to customize and optimize its performance.
The XCR3512XL-12FGG324I chip model is designed to provide a high-performance, low-power solution for a variety of applications. It is capable of supporting a wide range of communication protocols, and its advanced features make it suitable for use in a variety of advanced communication systems. The chip model also offers a wide range of features that can be used to customize and optimize its performance.
The XCR3512XL-12FGG324I chip model has a number of advantages that make it an attractive choice for many applications. It is capable of providing a powerful and reliable performance, and its advanced features make it suitable for use in a variety of advanced communication systems. The chip is also designed to be highly energy efficient, making it an ideal choice for applications that require low power consumption.
The XCR3512XL-12FGG324I chip model is expected to experience increasing demand in the future, due to its advanced features and capabilities. Its ability to support a wide range of communication protocols, as well as its energy efficiency, make it an ideal choice for a variety of applications. The chip model is also designed to be highly customizable, allowing users to optimize its performance for their specific needs.
The product description and specific design requirements of the XCR3512XL-12FGG324I chip model are available on the Xilinx website. This information includes detailed descriptions of the chip's features and capabilities, as well as the necessary precautions that must be taken when using the chip. Additionally, a number of case studies are available that provide real-world examples of the chip's performance in a range of applications.
Finally, the original design intention of the XCR3512XL-12FGG324I chip model and the possibility of future upgrades are also available on the Xilinx website. This information includes detailed descriptions of the chip's capabilities, as well as the potential for future upgrades and improvements. Additionally, the website also provides information on how the chip can be applied to advanced communication systems.
In conclusion, the XCR3512XL-12FGG324I chip model is a highly advanced and versatile piece of technology that has been developed by Xilinx to meet the needs of a variety of industries. Its features and capabilities make it an ideal choice for many different types of projects, and its energy efficiency and ability to support a wide range of communication protocols make it an attractive choice for many applications. The product description and design requirements are available on the Xilinx website, as well as information on its original design intention and the possibility of future upgrades.
You May Also Be Interested In
2,125 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $226.3248 | $226.3248 |
| 10+ | $223.8912 | $2,238.9120 |
| 100+ | $211.7232 | $21,172.3200 |
| 1000+ | $199.5552 | $99,777.6000 |
| 10000+ | $182.5200 | $182,520.0000 |
| The price is for reference only, please refer to the actual quotation! | ||