AMD Xilinx
XCR3384XL-12FGG324I
XCR3384XL-12FGG324I ECAD Model
XCR3384XL-12FGG324I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 12 ns | |
| Number of Macro Cells | 384 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 220 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 83 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3/3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3384XL-12FGG324I Datasheet Download
XCR3384XL-12FGG324I Overview
The XCR3384XL-12FGG324I is a high-performance chip model designed for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it a great choice for developers who need a powerful, reliable, and flexible chip model. With its advanced features and capabilities, the XCR3384XL-12FGG324I is suitable for a variety of applications.
The original design intention of the XCR3384XL-12FGG324I was to provide developers with a powerful and reliable chip model that could handle a wide range of tasks. The chip model is capable of performing complex calculations quickly and accurately, and its features allow for easy and effective communication between different components. Additionally, the chip model is designed to be easily upgradable, allowing developers to add new features and capabilities as needed. This makes it a great choice for developers who need a chip model that can keep up with the ever-changing demands of modern technology.
The XCR3384XL-12FGG324I is designed to meet the specific needs of developers. It has a wide range of features and capabilities, such as high-speed digital signal processing, embedded processing, and image processing. Additionally, the chip model is designed for use with the HDL language, making it a great choice for developers who need a powerful and reliable chip model. The chip model is also designed to be easily upgradeable, allowing developers to add new features and capabilities as needed.
When using the XCR3384XL-12FGG324I, it is important to take into account the specific design requirements of the chip model. It is important to understand the specific features and capabilities of the chip model, as well as how to use the HDL language to effectively program it. Additionally, it is important to understand the potential applications of the chip model, such as high-performance digital signal processing, embedded processing, and image processing. Furthermore, it is important to understand the potential of the chip model for use in advanced communication systems.
To demonstrate the power and flexibility of the XCR3384XL-12FGG324I, there are a number of case studies available. These case studies provide detailed information on how the chip model was used in various applications, such as digital signal processing, embedded processing, and image processing. Additionally, the case studies provide information on the design requirements of the chip model, as well as the potential applications of the chip model.
When using the XCR3384XL-12FGG324I, it is important to take into account the potential risks and precautions. It is important to understand the specific features and capabilities of the chip model, as well as how to use the HDL language to effectively program it. Additionally, it is important to understand the potential applications of the chip model, such as high-performance digital signal processing, embedded processing, and image processing. Furthermore, it is important to understand the potential of the chip model for use in advanced communication systems. Finally, it is important to understand the potential risks and precautions associated with the use of the XCR3384XL-12FGG324I.
The XCR3384XL-12FGG324I is a powerful and reliable chip model designed for digital signal processing, embedded processing, and image processing. With its advanced features and capabilities, the XCR3384XL-12FGG324I is suitable for a variety of applications. Additionally, the chip model is designed to be easily upgradable, allowing developers to add new features and capabilities as needed. Furthermore, the chip model is designed for use with the HDL language, making it a great choice for developers who need a powerful and reliable chip model. When using the XCR3384XL-12FGG324I, it is important to take into account the specific design requirements of the chip model, as well as the potential applications of the chip model and the potential risks and precautions associated with its use.
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