AMD Xilinx
XCR3384XL-12FGG324C
XCR3384XL-12FGG324C ECAD Model
XCR3384XL-12FGG324C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 12 ns | |
| Number of Macro Cells | 384 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 220 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 83 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3384XL-12FGG324C Datasheet Download
XCR3384XL-12FGG324C Overview
The XCR3384XL-12FGG324C is a chip model designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a powerful chip model, capable of handling complex tasks and providing reliable performance. The XCR3384XL-12FGG324C is designed with a HDL language, which offers a high level of flexibility and scalability to the user.
The XCR3384XL-12FGG324C offers many advantages over other chip models. It is highly versatile and can be used in a variety of applications. It is also highly reliable and offers superior performance. Additionally, it is cost-effective and has a low power consumption. These features make it an ideal choice for many industries.
The demand for the XCR3384XL-12FGG324C is expected to grow in the future as more industries realize the advantages of this chip model. It is already being used in many industries, such as automotive, aerospace, and medical. It is also being used in the development of advanced communication systems.
The original design intention of the XCR3384XL-12FGG324C was to provide a reliable, cost-effective, and low-power solution for high-performance digital signal processing, embedded processing, and image processing. It was designed to be highly versatile and able to handle complex tasks. It is also designed to be easily upgradable, allowing for future improvements.
The XCR3384XL-12FGG324C is a powerful chip model that is capable of handling complex tasks and providing reliable performance. It is cost-effective, has a low power consumption, and is highly versatile. The demand for this chip model is expected to grow in the future, and it is already being used in many industries. Additionally, it is designed to be easily upgradable, allowing for future improvements and the possibility of being applied to advanced communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||