AMD Xilinx
XCR3384XL-12FG324I
XCR3384XL-12FG324I ECAD Model
XCR3384XL-12FG324I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 12 ns | |
| Number of Macro Cells | 384 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 220 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 83 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3/3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3384XL-12FG324I Datasheet Download
XCR3384XL-12FG324I Overview
The chip model XCR3384XL-12FG324I is a powerful microcontroller designed for advanced communication systems. It is a highly integrated device that combines a 32-bit microprocessor core, memory, and peripheral interfaces into a single package. The original design intention of the chip model XCR3384XL-12FG324I was to provide a reliable and cost-effective solution for embedded systems.
The chip model XCR3384XL-12FG324I is capable of being upgraded in the future, making it a suitable solution for a wide range of applications. It has the potential to be used in advanced communication systems, including the development of intelligent robots. With its powerful microprocessor core, memory, and peripheral interfaces, the chip model XCR3384XL-12FG324I is capable of processing complex data and executing complex tasks.
The chip model XCR3384XL-12FG324I can be applied to a wide range of intelligent scenarios, such as autonomous vehicles, intelligent home systems, and smart factories. It can also be used in the era of fully intelligent systems, such as artificial intelligence (AI) and machine learning (ML). In order to use the chip model XCR3384XL-12FG324I effectively, technical talents such as software engineers, hardware engineers, and data scientists are needed.
In conclusion, the chip model XCR3384XL-12FG324I is a powerful microcontroller that can be used in advanced communication systems, intelligent robots, and fully intelligent systems. It is capable of being upgraded in the future, making it a suitable solution for a wide range of applications. In order to use the chip model XCR3384XL-12FG324I effectively, technical talents such as software engineers, hardware engineers, and data scientists are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||