AMD Xilinx
XCR3384XL-12FG324C
XCR3384XL-12FG324C ECAD Model
XCR3384XL-12FG324C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 12 ns | |
| Number of Macro Cells | 384 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 220 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 83 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3384XL-12FG324C Datasheet Download
XCR3384XL-12FG324C Overview
The XCR3384XL-12FG324C chip model is a revolutionary new development in the field of integrated circuits. It is designed to provide a number of advantages over its predecessors, including increased efficiency, better performance, and improved reliability. This model has been designed with the intention of providing a reliable and efficient platform for future development and upgrades, making it an ideal choice for a variety of applications.
The XCR3384XL-12FG324C chip model offers a number of advantages over its predecessors, including improved energy efficiency, better performance, and improved reliability. This makes it an ideal choice for a wide range of applications, including those in the communications, networking, and intelligent systems industries. As the demand for these types of technologies continues to grow, the XCR3384XL-12FG324C chip model is expected to be in high demand in the future.
The XCR3384XL-12FG324C chip model is designed to be easily upgradeable, making it a great choice for advanced communication systems. This chip model is capable of supporting a variety of protocols, making it an ideal choice for networks and intelligent systems. It is also capable of supporting a variety of intelligent scenarios, making it an ideal choice for the future of fully intelligent systems.
The XCR3384XL-12FG324C chip model is an ideal choice for a variety of applications, including those in the communications, networking, and intelligent systems industries. With its increased efficiency, better performance, and improved reliability, it is expected to be in high demand in the future. Its upgradeable design makes it a great choice for advanced communication systems, while its ability to support a variety of protocols and intelligent scenarios makes it an ideal choice for the future of fully intelligent systems.
You May Also Be Interested In
4,298 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||