XCR3384XL-10FGG324I
XCR3384XL-10FGG324I
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rohs

AMD Xilinx

XCR3384XL-10FGG324I


XCR3384XL-10FGG324I
F20-XCR3384XL-10FGG324I
Active
EE PLD, 10 ns, 384-Cell, CMOS, FBGA-324
FBGA-324

XCR3384XL-10FGG324I ECAD Model


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XCR3384XL-10FGG324I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 3.3 V
Propagation Delay 10 ns
Number of Macro Cells 384
Number of I/O Lines 220
Programmable Logic Type EE PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 220 I/O
Additional Feature YES
Clock Frequency-Max 102 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 3/3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 2.7 V
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,20X20,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-324
Pin Count 324
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XCR3384XL-10FGG324I Datasheet Download


XCR3384XL-10FGG324I Overview



The XCR3384XL-10FGG324I chip model is a high-performance, ultra-low power, and cost-effective solution for a wide range of applications. It is designed to meet the requirements of a variety of industries, including consumer electronics, automotive, and industrial automation. With its high-speed processing capabilities and low power consumption, the XCR3384XL-10FGG324I chip model is ideal for the development of intelligent robots.


The XCR3384XL-10FGG324I chip model offers a variety of advantages. It has an integrated high-speed processor that can be used to perform various tasks quickly and efficiently. The chip also features a built-in power management unit that can reduce power consumption and extend battery life. Additionally, the chip model is equipped with a wide range of peripherals, such as USB, I2C, and SPI, which can be used to connect external devices.


The XCR3384XL-10FGG324I chip model is expected to have a high demand in related industries in the future. This is due to its ability to provide a cost-effective solution for a variety of applications. For example, the chip model can be used to develop and popularize intelligent robots, as it has the necessary processing power and low power consumption for the task. Additionally, the chip model can be used in the automotive and industrial automation industries, as it can provide a reliable and efficient solution for these applications.


The XCR3384XL-10FGG324I chip model can be used for the development and popularization of future intelligent robots. This is due to its high-speed processing capabilities and low power consumption. Additionally, the chip model can be used to connect various external devices, such as sensors and actuators, which are essential for the development of intelligent robots. To use the model effectively, engineers and developers should have a good understanding of embedded systems, digital signal processing, and artificial intelligence.


Overall, the XCR3384XL-10FGG324I chip model is an excellent solution for a variety of applications. It is a high-performance, ultra-low power, and cost-effective solution that can be used for the development and popularization of future intelligent robots. To use the model effectively, engineers and developers should have a good understanding of embedded systems, digital signal processing, and artificial intelligence. With its wide range of advantages and expected high demand in related industries, the XCR3384XL-10FGG324I chip model is sure to be a popular choice in the future.



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