AMD Xilinx
XCR3384XL-10FGG324C
XCR3384XL-10FGG324C ECAD Model
XCR3384XL-10FGG324C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 10 ns | |
| Number of Macro Cells | 384 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 220 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 102 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3384XL-10FGG324C Datasheet Download
XCR3384XL-10FGG324C Overview
The XCR3384XL-10FGG324C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using HDL language, which allows it to be used in a wide range of applications.
The chip model XCR3384XL-10FGG324C is becoming increasingly popular in the industry due to its versatility and performance. As technology advances, new technologies may be required to support its application environment. In addition, the chip model XCR3384XL-10FGG324C can be used for network applications and intelligent scenarios. It is a powerful tool for the development of fully intelligent systems.
The chip model XCR3384XL-10FGG324C is a versatile and powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be programmed using HDL language and can be used in a wide range of applications. With the development of technology, new technologies may be needed to support its application environment. In addition, the chip model XCR3384XL-10FGG324C can be used for network applications and intelligent scenarios. It is becoming increasingly popular in the industry and is a powerful tool for the development of fully intelligent systems. The chip model XCR3384XL-10FGG324C is an ideal choice for those who are looking for a reliable and powerful tool for their digital signal processing, embedded processing, and image processing needs.
You May Also Be Interested In
3,073 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||