AMD Xilinx
XCR3384XL-10FG324C
XCR3384XL-10FG324C ECAD Model
XCR3384XL-10FG324C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 10 ns | |
| Number of Macro Cells | 384 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 220 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 102 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3384XL-10FG324C Datasheet Download
XCR3384XL-10FG324C Overview
The XCR3384XL-10FG324C chip model is a highly advanced and powerful model designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. It requires the use of HDL language for programming and development. This chip model is capable of providing high-speed processing and efficient data handling.
The XCR3384XL-10FG324C chip model is suitable for many applications in the field of networks and intelligent systems. It can be used for various network applications such as wireless communication, network security, and data analysis. It can also be used for intelligent applications such as natural language processing, image recognition, and machine learning. This chip model is suitable for the era of fully intelligent systems and can be used to build powerful and efficient systems.
The product description and specific design requirements of the XCR3384XL-10FG324C chip model are outlined in its documentation. It has high-speed operation, low power consumption, and excellent scalability. It also supports a wide range of programming languages such as Verilog, VHDL, and SystemVerilog. The chip model also supports various peripherals such as Ethernet, USB, and UART.
There are many case studies and real-world examples of the XCR3384XL-10FG324C chip model being used in various applications. For instance, it has been used in medical imaging systems to improve the accuracy and speed of image processing. It has also been used in robotics applications to enable robots to perform complex tasks accurately and efficiently.
When using the XCR3384XL-10FG324C chip model, it is important to keep in mind certain precautions. For instance, the chip model should be used with compatible hardware and software to ensure optimal performance. It is also important to be aware of the power consumption of the chip model and ensure that the power supply is adequate for the application. Finally, it is important to ensure that the programming language used is compatible with the chip model.
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