XC6VLX760-L1FF1760I
XC6VLX760-L1FF1760I
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rohs

AMD Xilinx

XC6VLX760-L1FF1760I


XC6VLX760-L1FF1760I
F20-XC6VLX760-L1FF1760I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, FBGA-1760
42.50 X 42.50 MM, FBGA-1760

XC6VLX760-L1FF1760I ECAD Model


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XC6VLX760-L1FF1760I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 1200
Number of Outputs 1200
Number of Logic Cells 758784
Combinatorial Delay of a CLB-Max 5.87 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 42.50 X 42.50 MM, FBGA-1760
Pin Count 1760
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC6VLX760-L1FF1760I Datasheet Download


XC6VLX760-L1FF1760I Overview



The XC6VLX760-L1FF1760I chip model is a powerful, high-performance digital signal processing (DSP) and embedded processing solution that is suitable for a variety of applications, such as image processing. This chip model is designed to be used with an HDL language, such as Verilog or VHDL, which makes it an ideal choice for advanced communication systems.


The XC6VLX760-L1FF1760I chip model was designed with the intention of providing a reliable and highly efficient solution for various processing tasks. It has a wide range of features, including a high-performance processor core, a high-speed bus interface, and a flexible memory architecture. This chip model is capable of being upgraded in the future, allowing for improved performance and more advanced features.


The product description of the XC6VLX760-L1FF1760I chip model outlines the specific design requirements and capabilities of the chip. It includes details on the processor core, memory architecture, bus interface, and other features. Additionally, it provides information on the power consumption and the operating temperature range of the chip.


In order to ensure the successful implementation of the XC6VLX760-L1FF1760I chip model, there are a few important design considerations that must be taken into account. These include the type of HDL language that is used, the size of the memory architecture, and the power consumption. Additionally, it is important to consider the compatibility of the chip with existing systems and the potential for future upgrades.


Case studies and customer reviews can provide valuable insights into the effectiveness and reliability of the XC6VLX760-L1FF1760I chip model. These can be used to determine if the chip is suitable for a particular application and to understand the potential benefits and drawbacks of using the chip. Additionally, it is important to consider any potential safety and security issues that may arise when using the chip.


The XC6VLX760-L1FF1760I chip model is a powerful and reliable digital signal processing and embedded processing solution that is suitable for a variety of applications. It is designed to be used with an HDL language, allowing for a wide range of features and potential for future upgrades. It is important to take into account the design requirements, compatibility, and potential safety and security issues when considering the use of this chip model.



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