
AMD Xilinx
XC6VLX760-L1FF1760I
XC6VLX760-L1FF1760I ECAD Model
XC6VLX760-L1FF1760I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 1200 | |
Number of Outputs | 1200 | |
Number of Logic Cells | 758784 | |
Combinatorial Delay of a CLB-Max | 5.87 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 42.50 X 42.50 MM, FBGA-1760 | |
Pin Count | 1760 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC6VLX760-L1FF1760I Datasheet Download
XC6VLX760-L1FF1760I Overview
The XC6VLX760-L1FF1760I chip model is a powerful, high-performance digital signal processing (DSP) and embedded processing solution that is suitable for a variety of applications, such as image processing. This chip model is designed to be used with an HDL language, such as Verilog or VHDL, which makes it an ideal choice for advanced communication systems.
The XC6VLX760-L1FF1760I chip model was designed with the intention of providing a reliable and highly efficient solution for various processing tasks. It has a wide range of features, including a high-performance processor core, a high-speed bus interface, and a flexible memory architecture. This chip model is capable of being upgraded in the future, allowing for improved performance and more advanced features.
The product description of the XC6VLX760-L1FF1760I chip model outlines the specific design requirements and capabilities of the chip. It includes details on the processor core, memory architecture, bus interface, and other features. Additionally, it provides information on the power consumption and the operating temperature range of the chip.
In order to ensure the successful implementation of the XC6VLX760-L1FF1760I chip model, there are a few important design considerations that must be taken into account. These include the type of HDL language that is used, the size of the memory architecture, and the power consumption. Additionally, it is important to consider the compatibility of the chip with existing systems and the potential for future upgrades.
Case studies and customer reviews can provide valuable insights into the effectiveness and reliability of the XC6VLX760-L1FF1760I chip model. These can be used to determine if the chip is suitable for a particular application and to understand the potential benefits and drawbacks of using the chip. Additionally, it is important to consider any potential safety and security issues that may arise when using the chip.
The XC6VLX760-L1FF1760I chip model is a powerful and reliable digital signal processing and embedded processing solution that is suitable for a variety of applications. It is designed to be used with an HDL language, allowing for a wide range of features and potential for future upgrades. It is important to take into account the design requirements, compatibility, and potential safety and security issues when considering the use of this chip model.
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