AMD Xilinx
XC6VLX760-2FF1760I
XC6VLX760-2FF1760I ECAD Model
XC6VLX760-2FF1760I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 758784 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, FBGA-1760 | |
| Pin Count | 1760 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC6VLX760-2FF1760I Datasheet Download
XC6VLX760-2FF1760I Overview
The chip model XC6VLX760-2FF1760I is a cutting-edge model developed by Xilinx, a leader in the field of programmable logic devices. This chip model is capable of providing high performance and low power consumption, making it an ideal choice for many applications. It is also capable of supporting a wide range of high-speed interfaces, making it suitable for a variety of applications.
The chip model XC6VLX760-2FF1760I is gaining popularity in the industry due to its many advantages. It features a large number of programmable logic elements, allowing for a wide range of applications. It also has a high level of integration, allowing for the development of complex designs with minimal hardware resources. Furthermore, it can support a wide range of high-speed interfaces, allowing for the development of applications with high data throughput.
The demand for the chip model XC6VLX760-2FF1760I is expected to grow in the future. As the demand for advanced technologies increases, the need for advanced chip models such as this one will also increase. It is expected that this chip model will be used in a variety of applications, including networking, telecommunications, industrial automation, and consumer electronics. Furthermore, it is expected that the chip model will be used in the development of intelligent systems and networks.
The chip model XC6VLX760-2FF1760I is expected to be used in a variety of applications in the future. It is expected to be used in the development of networks and communication systems, as well as in the development of intelligent systems. It is also expected to be used in the development of consumer electronics and industrial automation systems. Furthermore, it is expected to be used in the development of fully intelligent systems in the future.
In conclusion, the chip model XC6VLX760-2FF1760I is a powerful and versatile model that is gaining popularity in the industry. It features a large number of programmable logic elements, allowing for a wide range of applications. It also has a high level of integration, allowing for the development of complex designs with minimal hardware resources. Furthermore, it can support a wide range of high-speed interfaces, allowing for the development of applications with high data throughput. The demand for this chip model is expected to grow in the future, as the demand for advanced technologies increases. It is expected to be used in a variety of applications in the future, including networking, telecommunications, industrial automation, and consumer electronics. Furthermore, it is expected to be used in the development of intelligent systems and networks, as well as in the development of fully intelligent systems in the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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