
AMD Xilinx
XC6VLX760-L1FF1760C
XC6VLX760-L1FF1760C ECAD Model
XC6VLX760-L1FF1760C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 1200 | |
Number of Outputs | 1200 | |
Number of Logic Cells | 758784 | |
Combinatorial Delay of a CLB-Max | 5.87 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 42.50 X 42.50 MM, FBGA-1760 | |
Pin Count | 1760 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.7.A |
XC6VLX760-L1FF1760C Datasheet Download
XC6VLX760-L1FF1760C Overview
The XC6VLX760-L1FF1760C chip model is a highly advanced and powerful processor that has the potential to revolutionize the way networks are managed and how intelligent systems are developed. It is a low-power, high-performance FPGA that is designed to be used in a variety of applications.
The XC6VLX760-L1FF1760C chip model is designed for a wide range of applications, including network processing, image processing, and artificial intelligence (AI). It is capable of supporting a variety of network protocols, including Ethernet, Wi-Fi, and Bluetooth. It also supports a variety of AI algorithms, such as deep learning and machine learning.
The XC6VLX760-L1FF1760C chip model is a great choice for developing intelligent systems. It is well-suited for applications such as autonomous driving, robotics, and smart home systems. It is capable of running complex algorithms in real time and can be used to develop advanced AI systems.
The XC6VLX760-L1FF1760C chip model is also a great choice for developing robots. It is capable of running complex algorithms in real time and is well-suited for applications such as autonomous navigation, object recognition, and voice recognition. It is also capable of running multiple tasks simultaneously and can be used to develop intelligent robots with advanced capabilities.
The product description and specific design requirements of the XC6VLX760-L1FF1760C chip model should be carefully studied to ensure that the chip is used correctly and efficiently. It is important to be aware of the chip's power and performance requirements, as well as the specific design requirements of the application. Additionally, it is important to understand the chip's limitations and the potential risks associated with its use.
In order to use the XC6VLX760-L1FF1760C chip model effectively, it is important to have a strong understanding of computer engineering, software engineering, and electrical engineering. Additionally, it is important to have a good understanding of the specific application and the requirements of the chip model.
Overall, the XC6VLX760-L1FF1760C chip model is a powerful and versatile chip that can be used to develop a variety of intelligent systems and robots. It is important to understand the product description and design requirements of the chip model in order to use it effectively. Additionally, it is important to have a strong understanding of computer engineering, software engineering, and electrical engineering in order to use the chip model effectively.
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