XC6VLX760-L1FF1760C
XC6VLX760-L1FF1760C
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rohs

AMD Xilinx

XC6VLX760-L1FF1760C


XC6VLX760-L1FF1760C
F20-XC6VLX760-L1FF1760C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, FBGA-1760
42.50 X 42.50 MM, FBGA-1760

XC6VLX760-L1FF1760C ECAD Model


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XC6VLX760-L1FF1760C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 1200
Number of Outputs 1200
Number of Logic Cells 758784
Combinatorial Delay of a CLB-Max 5.87 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 42.50 X 42.50 MM, FBGA-1760
Pin Count 1760
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A001.A.7.A

XC6VLX760-L1FF1760C Datasheet Download


XC6VLX760-L1FF1760C Overview



The XC6VLX760-L1FF1760C chip model is a highly advanced and powerful processor that has the potential to revolutionize the way networks are managed and how intelligent systems are developed. It is a low-power, high-performance FPGA that is designed to be used in a variety of applications.


The XC6VLX760-L1FF1760C chip model is designed for a wide range of applications, including network processing, image processing, and artificial intelligence (AI). It is capable of supporting a variety of network protocols, including Ethernet, Wi-Fi, and Bluetooth. It also supports a variety of AI algorithms, such as deep learning and machine learning.


The XC6VLX760-L1FF1760C chip model is a great choice for developing intelligent systems. It is well-suited for applications such as autonomous driving, robotics, and smart home systems. It is capable of running complex algorithms in real time and can be used to develop advanced AI systems.


The XC6VLX760-L1FF1760C chip model is also a great choice for developing robots. It is capable of running complex algorithms in real time and is well-suited for applications such as autonomous navigation, object recognition, and voice recognition. It is also capable of running multiple tasks simultaneously and can be used to develop intelligent robots with advanced capabilities.


The product description and specific design requirements of the XC6VLX760-L1FF1760C chip model should be carefully studied to ensure that the chip is used correctly and efficiently. It is important to be aware of the chip's power and performance requirements, as well as the specific design requirements of the application. Additionally, it is important to understand the chip's limitations and the potential risks associated with its use.


In order to use the XC6VLX760-L1FF1760C chip model effectively, it is important to have a strong understanding of computer engineering, software engineering, and electrical engineering. Additionally, it is important to have a good understanding of the specific application and the requirements of the chip model.


Overall, the XC6VLX760-L1FF1760C chip model is a powerful and versatile chip that can be used to develop a variety of intelligent systems and robots. It is important to understand the product description and design requirements of the chip model in order to use it effectively. Additionally, it is important to have a strong understanding of computer engineering, software engineering, and electrical engineering in order to use the chip model effectively.



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