XC6VLX760-2FF1760C
XC6VLX760-2FF1760C
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rohs

AMD Xilinx

XC6VLX760-2FF1760C


XC6VLX760-2FF1760C
F20-XC6VLX760-2FF1760C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, FBGA-1760
42.50 X 42.50 MM, FBGA-1760

XC6VLX760-2FF1760C ECAD Model


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XC6VLX760-2FF1760C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 1200
Number of Outputs 1200
Number of Logic Cells 758784
Combinatorial Delay of a CLB-Max 4.29 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.286 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 42.50 X 42.50 MM, FBGA-1760
Pin Count 1760
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC6VLX760-2FF1760C Datasheet Download


XC6VLX760-2FF1760C Overview



The XC6VLX760-2FF1760C is a state-of-the-art chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is a versatile chip that is capable of handling a variety of tasks, from data processing to image analysis. The XC6VLX760-2FF1760C is designed to be used with the HDL (Hardware Description Language) language, making it an ideal choice for those who need to develop complex systems.


The XC6VLX760-2FF1760C was designed with the future in mind. It has a modular architecture that can be easily upgraded with new features and capabilities. It is also capable of being used in advanced communication systems, making it a great choice for those who need to build reliable and secure networks.


When designing a system with the XC6VLX760-2FF1760C, there are several key design considerations to keep in mind. First, the chip model should be designed to meet the specific needs of the system. This includes selecting the right components for the job and ensuring that the system is properly configured for the desired performance. Additionally, the HDL language should be used to ensure that the system is properly optimized for the chip model.


Finally, it is important to consider the actual case studies and precautions that should be taken when using the XC6VLX760-2FF1760C. These include considering the power requirements, temperature limitations, and other environmental factors that could affect the performance of the chip model. Additionally, it is important to consider the system's security and reliability, as well as any potential risks associated with using the chip model.


In conclusion, the XC6VLX760-2FF1760C is an excellent choice for those who need a powerful and versatile chip model for digital signal processing, embedded processing, and image processing. Its modular architecture makes it easy to upgrade, and its compatibility with the HDL language ensures that the system is properly optimized for the chip model. Additionally, it is important to consider the actual case studies and precautions that should be taken when using the XC6VLX760-2FF1760C, as well as its compatibility with advanced communication systems.



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QTY Unit Price Ext Price
1+ $15,189.1618 $15,189.1618
10+ $15,025.8374 $150,258.3744
100+ $14,209.2158 $1,420,921.5840
1000+ $13,392.5942 $6,696,297.1200
10000+ $12,249.3240 $12,249,324.0000
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