AMD Xilinx
XC6VLX760-1FF1760I
XC6VLX760-1FF1760I ECAD Model
XC6VLX760-1FF1760I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 758784 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, FBGA-1760 | |
| Pin Count | 1760 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX760-1FF1760I Datasheet Download
XC6VLX760-1FF1760I Overview
The XC6VLX760-1FF1760I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to enable users to take advantage of the latest technology advancements with the help of HDL language.
The chip model is designed to meet the needs of high-performance applications. It is capable of providing high-speed data processing, low power consumption, and high-quality image processing. Additionally, it is capable of supporting advanced communication systems and is capable of future upgrades.
The chip model is designed to be used in a wide range of industries. It is suitable for applications such as automotive, aerospace, industrial, medical, and consumer electronics. It is also capable of handling complex tasks such as 3D rendering, image processing, and data analysis.
The chip model is designed to run on various platforms such as Windows, Linux, and Android. It is also capable of running on embedded systems such as FPGA and ARM. This makes it a versatile tool for many different applications.
The chip model is designed to be compatible with the latest technologies. It is capable of supporting advanced communication protocols such as Wi-Fi, Bluetooth, and Zigbee. Additionally, it is capable of supporting advanced security protocols such as TLS, SSL, and IPSec.
The chip model is designed to be used in a wide range of applications. It is capable of providing high-performance computing for image processing, video encoding, and audio processing. Additionally, it is capable of providing real-time data analysis for applications such as medical imaging, autonomous vehicles, and robotics.
The chip model is designed to be a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is capable of providing high-performance computing, low power consumption, and high-quality image processing. Additionally, it is capable of supporting advanced communication systems and is capable of future upgrades. It is suitable for a wide range of industries and applications and is capable of supporting the latest technologies. This makes it an ideal tool for many different applications.
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|---|---|---|
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