XC6VLX550T-L1FF1760I
XC6VLX550T-L1FF1760I
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AMD Xilinx

XC6VLX550T-L1FF1760I

XC6VLX550T-L1FF1760I
AMD Xilinx
F20-XC6VLX550T-L1FF1760I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, FBGA-1760
42.50 X 42.50 MM, FBGA-1760
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XC6VLX550T-L1FF1760I Datasheet (PDF)
XC6VLX550T-L1FF1760I Document (PDF)

XC6VLX550T-L1FF1760I ECAD Model

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XC6VLX550T-L1FF1760I Attributes

Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 1200
Number of Outputs 1200
Number of Logic Cells 549888
Combinatorial Delay of a CLB-Max 5.87 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 42.50 X 42.50 MM, FBGA-1760
Pin Count 1760
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC6VLX550T-L1FF1760I Datasheet Download

XC6VLX550T-L1FF1760I Overview


The chip model XC6VLX550T-L1FF1760I is a state-of-the-art integrated circuit (IC) developed by Xilinx, Inc. It is designed to provide high performance digital signal processing, embedded processing, image processing, and other related functions. The model is programmed using a hardware description language (HDL) such as Verilog or VHDL. The XC6VLX550T-L1FF1760I is widely used in the fields of communications, automotive, aerospace, industrial automation, medical, and consumer electronics.


The XC6VLX550T-L1FF1760I offers several advantages over other ICs. It is highly flexible and can be used for a wide range of applications, from high-performance digital signal processing to embedded processing and image processing. It also has a high-speed clock frequency and low-power consumption, making it suitable for applications that require high-speed operation and low energy consumption. Furthermore, the XC6VLX550T-L1FF1760I has a wide range of memory and I/O options, allowing for the development of complex systems.


Due to the increasing demand for advanced ICs in the fields of communications, automotive, aerospace, industrial automation, medical, and consumer electronics, the demand for the XC6VLX550T-L1FF1760I is expected to grow in the future. This is due to the fact that the XC6VLX550T-L1FF1760I offers a wide range of features and performance capabilities that make it suitable for a variety of applications.


The XC6VLX550T-L1FF1760I can be applied to the development and popularization of future intelligent robots. This is because the XC6VLX550T-L1FF1760I has the necessary features and performance capabilities that enable the development of sophisticated robotic systems. Furthermore, the XC6VLX550T-L1FF1760I can be programmed using HDL, which is a powerful language used for developing embedded systems.


In order to use the XC6VLX550T-L1FF1760I effectively, certain technical talents are required. This includes expertise in HDL programming, knowledge of digital signal processing, embedded processing, and image processing, and familiarity with the Xilinx development tools. Furthermore, knowledge of robotics and artificial intelligence is also beneficial when developing robotic systems using the XC6VLX550T-L1FF1760I.



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Parts Index

XC6VLX550T-L1FF1760
2
XC6VLX550T-L1FF
8
XC6VLX550T-L1
8
XC6VLX550T-L
8
XC6VLX550
55
XC6VLX
516
XC6
25396
XC
65616