AMD Xilinx
XC6VLX550T-L1FF1760C
XC6VLX550T-L1FF1760C ECAD Model
XC6VLX550T-L1FF1760C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 549888 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, FBGA-1760 | |
| Pin Count | 1760 | |
| ECCN Code | 3A001.A.7.A |
XC6VLX550T-L1FF1760C Datasheet Download
XC6VLX550T-L1FF1760C Overview
The XC6VLX550T-L1FF1760C chip model is a powerful and versatile device that is ideal for a range of applications, including high-performance digital signal processing, embedded processing, and image processing, among others. It requires the use of the Hardware Description Language (HDL) to program and operate the chip.
The XC6VLX550T-L1FF1760C chip model has a number of advantages that make it one of the most desirable chips on the market. It has a high clock speed of 550 MHz, a large number of logic cells, and a wide range of I/O ports. This makes it suitable for a variety of applications, including those that require high-performance computing. Additionally, the chip is highly reliable and consumes less power than other similar chips on the market.
Given the increasing demand for high-performance computing, the XC6VLX550T-L1FF1760C chip model is expected to remain in high demand in the future. As the demand for more powerful and reliable chips increases, the XC6VLX550T-L1FF1760C chip model is likely to become even more popular as it offers an ideal combination of features and performance.
The XC6VLX550T-L1FF1760C chip model can be applied to the development of future intelligent robots. The chip's high clock speed, large number of logic cells, and wide range of I/O ports make it well-suited for powering the sophisticated algorithms needed for the development of robots. In order to make the most of the chip model, it is important to have a team of experienced technical professionals who are familiar with HDL and have a solid understanding of the chip's features and capabilities.
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|---|---|---|
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