AMD Xilinx
XC2V8000-6FFG1517I
XC2V8000-6FFG1517I ECAD Model
XC2V8000-6FFG1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 8000000 | |
| Number of CLBs | 11648 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11648 CLBS, 8000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V8000-6FFG1517I Datasheet Download
XC2V8000-6FFG1517I Overview
The XC2V8000-6FFG1517I chip model is one of the most advanced models currently available on the market, and it is expected to be highly sought after in the near future. This chip model is designed with the intention of providing users with a powerful and versatile tool for a variety of applications. It is one of the highest-performance models available, offering a wide range of features and capabilities.
This chip model is capable of supporting a wide range of communication systems, from basic to advanced. It is also capable of handling a variety of tasks, from basic data processing to complex calculations. It is also capable of supporting a wide range of applications, such as robotics, machine learning, and artificial intelligence.
The XC2V8000-6FFG1517I chip model is also capable of being upgraded in the future. This means that users can take advantage of the latest technology and features that are available. This chip model is also capable of being used in the development and popularization of future intelligent robots.
In order to use the XC2V8000-6FFG1517I chip model effectively, users need to be familiar with the chip's capabilities and features. They also need to have a good understanding of the programming languages that are used to program the chip. Additionally, they need to have a good understanding of the algorithms and techniques used in the development of robotics and artificial intelligence.
The XC2V8000-6FFG1517I chip model is an incredibly powerful and versatile tool that is expected to be highly sought after in the near future. It is capable of supporting a wide range of applications, from basic data processing to complex calculations. It is also capable of being upgraded in the future and used in the development and popularization of future intelligent robots. In order to use the chip model effectively, users need to be familiar with its capabilities and features, as well as the programming languages and algorithms used in the development of robotics and artificial intelligence.
You May Also Be Interested In
4,286 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||