AMD Xilinx
XC2V8000-4FF1517C
XC2V8000-4FF1517C ECAD Model
XC2V8000-4FF1517C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 1108 | |
| Number of Outputs | 1108 | |
| Number of Logic Cells | 104832 | |
| Number of Equivalent Gates | 8000000 | |
| Number of CLBs | 11648 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11648 CLBS, 8000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2V8000-4FF1517C Datasheet Download
XC2V8000-4FF1517C Overview
The XC2V8000-4FF1517C chip model is a high-quality, feature-rich model designed to meet the needs of a variety of industries. This model is designed to meet the demands of the most advanced communication systems and can be used for many different applications. The XC2V8000-4FF1517C chip model offers a range of advantages that make it an attractive choice for many industries.
The XC2V8000-4FF1517C chip model is designed with a number of features that make it ideal for use in advanced communication systems. It is capable of supporting up to 8.5Gbps of data transfer speeds and can handle a wide range of communication protocols. The chip also offers a low power consumption rate, making it suitable for use in mobile and portable devices. Additionally, the chip is designed with built-in security features, making it an ideal choice for secure communication systems.
The XC2V8000-4FF1517C chip model is designed with a number of features that make it an attractive choice for many industries. It is capable of supporting up to 8.5Gbps of data transfer speeds and can handle a wide range of communication protocols. Additionally, the chip is designed with built-in security features, making it an ideal choice for secure communication systems. The chip also offers a low power consumption rate, making it suitable for use in mobile and portable devices.
The XC2V8000-4FF1517C chip model is designed to meet the demands of the most advanced communication systems and can be used for many different applications. The chip is designed to be easily upgradable and can be adapted to meet the needs of any future communication system. Additionally, the chip is designed with a number of features that make it an attractive choice for many industries.
The product description and specific design requirements of the XC2V8000-4FF1517C chip model are designed to meet the needs of a variety of industries. The chip model is designed to be compatible with a wide range of communication protocols and is capable of supporting up to 8.5Gbps of data transfer speeds. Additionally, the chip is designed with built-in security features, making it an ideal choice for secure communication systems.
Actual case studies and precautions should be taken when using the XC2V8000-4FF1517C chip model. It is important to ensure that the chip is compatible with the communication protocols in use and that the chip is properly configured to meet the needs of the application. Additionally, it is important to ensure that the chip is properly maintained and that any necessary upgrades are performed in a timely manner.
In conclusion, the XC2V8000-4FF1517C chip model is an attractive choice for many industries due to its range of features and its ability to be easily adapted to meet the needs of any future communication system. It is designed to be compatible with a wide range of communication protocols and is capable of supporting up to 8.5Gbps of data transfer speeds. Additionally, the chip is designed with built-in security features, making it an ideal choice for secure communication systems. With its range of features and its ability to be easily upgraded, the XC2V8000-4FF1517C chip model is expected to remain a popular choice for many industries in the future.
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3,319 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,566.7569 | $1,566.7569 |
| 10+ | $1,549.9100 | $15,499.1002 |
| 100+ | $1,465.6758 | $146,567.5776 |
| 1000+ | $1,381.4415 | $690,720.7680 |
| 10000+ | $1,263.5136 | $1,263,513.6000 |
| The price is for reference only, please refer to the actual quotation! | ||