AMD Xilinx
XC2V8000-6FF1517C
XC2V8000-6FF1517C ECAD Model
XC2V8000-6FF1517C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 1108 | |
| Number of Outputs | 1108 | |
| Number of Logic Cells | 104832 | |
| Number of Equivalent Gates | 8000000 | |
| Number of CLBs | 11648 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11648 CLBS, 8000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V8000-6FF1517C Datasheet Download
XC2V8000-6FF1517C Overview
The XC2V8000-6FF1517C chip model is a versatile, high-performance device that can be used for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be programmed using the HDL language, making it a powerful tool for those who understand the language.
The potential applications of the XC2V8000-6FF1517C chip model in networks and other intelligent scenarios are vast. It has the capability to be used in the age of fully intelligent systems, where machines are able to learn and process data autonomously. This could be used in a variety of ways, such as for facial recognition, natural language processing, and other forms of artificial intelligence.
The XC2V8000-6FF1517C chip model could also be used in the development and popularization of future intelligent robots. Its high-performance capabilities and programming language make it well-suited for the task. It could be used to create robots that can interact with humans, understand their environment, and complete tasks autonomously.
In order to use the XC2V8000-6FF1517C chip model effectively, technical talents are required. Those who understand the HDL language and have experience in programming and robotics will be best suited for the job. Knowledge of the chip model itself, as well as the various applications and scenarios in which it can be used, will also be necessary. With the right skills and knowledge, this chip model could be used to create powerful and intelligent robots that could revolutionize the world.
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4,572 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $803.5200 | $803.5200 |
| 10+ | $794.8800 | $7,948.8000 |
| 100+ | $751.6800 | $75,168.0000 |
| 1000+ | $708.4800 | $354,240.0000 |
| 10000+ | $648.0000 | $648,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||