XC2V8000-6FFG1152I
XC2V8000-6FFG1152I
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rohs

AMD Xilinx

XC2V8000-6FFG1152I


XC2V8000-6FFG1152I
F20-XC2V8000-6FFG1152I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152

XC2V8000-6FFG1152I ECAD Model


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XC2V8000-6FFG1152I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Equivalent Gates 8000000
Number of CLBs 11648
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 11648 CLBS, 8000000 GATES
Clock Frequency-Max 820 MHz
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
Pin Count 1152
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2V8000-6FFG1152I Datasheet Download


XC2V8000-6FFG1152I Overview



The Xilinx XC2V8000-6FFG1152I chip model is a high-performance, multi-purpose field-programmable gate array (FPGA) device designed to meet the needs of a wide range of applications. With its efficient power management, high-speed logic, and high-density programmable interconnects, the XC2V8000-6FFG1152I is ideal for applications requiring high-performance, low-power, and high-density solutions.


The original design intention of the XC2V8000-6FFG1152I was to provide a flexible, high-performance solution for a variety of applications. It is designed to be suitable for a wide range of applications, from basic logic to complex data processing and high-speed communication. The device can be used in advanced communication systems such as Ethernet, Fibre Channel, and InfiniBand. It is also suitable for applications such as high-speed data acquisition, image processing, and digital signal processing.


The XC2V8000-6FFG1152I chip model offers high performance, low power, and high density solutions, making it suitable for a wide range of applications. It is also capable of being upgraded to meet the needs of future applications. This makes it a great choice for applications that require a high degree of flexibility and scalability.


The XC2V8000-6FFG1152I is also suitable for use in the era of fully intelligent systems. It can be used in networks to provide intelligent solutions such as network monitoring, network control, and network optimization. It can also be used in intelligent scenarios such as machine learning, artificial intelligence, and natural language processing.


In terms of product description and specific design requirements, the XC2V8000-6FFG1152I chip model has a 6-layer metal programmable interconnect structure and is optimized for high-speed and low-power operation. It has a total of 1152 programmable logic elements, making it suitable for a wide range of applications. The device also has a wide range of memory and I/O options, making it suitable for a variety of applications.


In addition to its design features, the XC2V8000-6FFG1152I chip model also has a number of case studies that demonstrate its performance and capabilities. These include a high-speed data acquisition system, an image processing system, and a digital signal processing system. These cases provide an insight into the performance of the device and can be used as a reference for designing similar systems.


Finally, when using the XC2V8000-6FFG1152I chip model, it is important to consider the power requirements of the system and to ensure that the device is properly cooled. In addition, it is important to ensure that the device is configured correctly and that all of the necessary components are present and functioning properly.


The Xilinx XC2V8000-6FFG1152I chip model is a high-performance, multi-purpose FPGA device that is suitable for a wide range of applications. It has a 6-layer metal programmable interconnect structure and is optimized for high-speed and low-power operation. It is suitable for use in advanced communication systems, networks, and intelligent scenarios, and can be upgraded to meet the needs of future applications. The device also has a number of case studies that demonstrate its performance and capabilities, and it is important to consider the power requirements of the system and to ensure that the device is properly cooled and configured correctly.



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