
AMD Xilinx
XC2V8000-6FFG1152I
XC2V8000-6FFG1152I ECAD Model
XC2V8000-6FFG1152I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Equivalent Gates | 8000000 | |
Number of CLBs | 11648 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 11648 CLBS, 8000000 GATES | |
Clock Frequency-Max | 820 MHz | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
Pin Count | 1152 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2V8000-6FFG1152I Datasheet Download
XC2V8000-6FFG1152I Overview
The Xilinx XC2V8000-6FFG1152I chip model is a high-performance, multi-purpose field-programmable gate array (FPGA) device designed to meet the needs of a wide range of applications. With its efficient power management, high-speed logic, and high-density programmable interconnects, the XC2V8000-6FFG1152I is ideal for applications requiring high-performance, low-power, and high-density solutions.
The original design intention of the XC2V8000-6FFG1152I was to provide a flexible, high-performance solution for a variety of applications. It is designed to be suitable for a wide range of applications, from basic logic to complex data processing and high-speed communication. The device can be used in advanced communication systems such as Ethernet, Fibre Channel, and InfiniBand. It is also suitable for applications such as high-speed data acquisition, image processing, and digital signal processing.
The XC2V8000-6FFG1152I chip model offers high performance, low power, and high density solutions, making it suitable for a wide range of applications. It is also capable of being upgraded to meet the needs of future applications. This makes it a great choice for applications that require a high degree of flexibility and scalability.
The XC2V8000-6FFG1152I is also suitable for use in the era of fully intelligent systems. It can be used in networks to provide intelligent solutions such as network monitoring, network control, and network optimization. It can also be used in intelligent scenarios such as machine learning, artificial intelligence, and natural language processing.
In terms of product description and specific design requirements, the XC2V8000-6FFG1152I chip model has a 6-layer metal programmable interconnect structure and is optimized for high-speed and low-power operation. It has a total of 1152 programmable logic elements, making it suitable for a wide range of applications. The device also has a wide range of memory and I/O options, making it suitable for a variety of applications.
In addition to its design features, the XC2V8000-6FFG1152I chip model also has a number of case studies that demonstrate its performance and capabilities. These include a high-speed data acquisition system, an image processing system, and a digital signal processing system. These cases provide an insight into the performance of the device and can be used as a reference for designing similar systems.
Finally, when using the XC2V8000-6FFG1152I chip model, it is important to consider the power requirements of the system and to ensure that the device is properly cooled. In addition, it is important to ensure that the device is configured correctly and that all of the necessary components are present and functioning properly.
The Xilinx XC2V8000-6FFG1152I chip model is a high-performance, multi-purpose FPGA device that is suitable for a wide range of applications. It has a 6-layer metal programmable interconnect structure and is optimized for high-speed and low-power operation. It is suitable for use in advanced communication systems, networks, and intelligent scenarios, and can be upgraded to meet the needs of future applications. The device also has a number of case studies that demonstrate its performance and capabilities, and it is important to consider the power requirements of the system and to ensure that the device is properly cooled and configured correctly.
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