AMD Xilinx
XC2V8000-6FF1152C
XC2V8000-6FF1152C ECAD Model
XC2V8000-6FF1152C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 824 | |
| Number of Outputs | 824 | |
| Number of Logic Cells | 104832 | |
| Number of Equivalent Gates | 8000000 | |
| Number of CLBs | 11648 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11648 CLBS, 8000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V8000-6FF1152C Datasheet Download
XC2V8000-6FF1152C Overview
The XC2V8000-6FF1152C chip model is a high-performance integrated circuit that is suitable for digital signal processing, embedded processing, and image processing. It requires the use of the HDL language for programming. As the technology industry continues to develop, the XC2V8000-6FF1152C chip model will continue to be used in a variety of applications.
In terms of networking, the XC2V8000-6FF1152C chip model can be used to create high-speed, low-latency networks. This chip model can be used to create networks that are capable of handling large amounts of data quickly and efficiently. It can also be used to create networks that are resistant to interference and can handle high-speed data transfers. Furthermore, this chip model can be used to create networks that are secure and robust.
In terms of intelligent scenarios, the XC2V8000-6FF1152C chip model can be used to create intelligent systems that can be used to automate tasks. This chip model can be used to create systems that can learn from data and can be used to make decisions in real-time. It can also be used to create systems that can interact with users and can be used to provide personalized recommendations.
In order to support the application of the XC2V8000-6FF1152C chip model in the era of fully intelligent systems, new technologies will need to be implemented. This includes the development of artificial intelligence and machine learning algorithms that can be used to process data and make decisions. Additionally, new technologies such as 5G, Augmented Reality, and Virtual Reality will need to be implemented in order to create fully immersive and interactive experiences.
Overall, the XC2V8000-6FF1152C chip model is a powerful and versatile integrated circuit that can be used for a variety of applications. It can be used to create high-speed networks, intelligent systems, and immersive experiences. As the technology industry continues to develop, the possibilities of what this chip model can be used for will continue to expand.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||