AMD Xilinx
XC2V8000-4FF1152C
XC2V8000-4FF1152C ECAD Model
XC2V8000-4FF1152C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 824 | |
| Number of Outputs | 824 | |
| Number of Logic Cells | 104832 | |
| Number of Equivalent Gates | 8000000 | |
| Number of CLBs | 11648 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11648 CLBS, 8000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2V8000-4FF1152C Datasheet Download
XC2V8000-4FF1152C Overview
The chip model XC2V8000-4FF1152C is a high-performance FPGA designed by Xilinx. It is a powerful and reliable chip model that can be applied to various fields such as aerospace, automotive, communications, industrial, medical and military. It has a capacity of up to 8 million system gates and can support up to 1152 I/Os. The chip model is capable of providing high-speed signal processing, high-speed data transfer, and various other features.
When it comes to industry trends, the chip model XC2V8000-4FF1152C is expected to continue to be used in various applications and industries. In the future, it is likely to be used in more advanced communication systems, such as 5G networks. It is also expected to be used in intelligent scenarios, such as autonomous driving, smart homes, and other applications that require high-speed data processing.
The chip model XC2V8000-4FF1152C has been designed with the intention to support future upgrades. It is expected to be able to support new technologies, such as artificial intelligence and machine learning, as the needs of the application environment evolve. It is also likely to be used in the era of fully intelligent systems, such as the Internet of Things (IoT).
In conclusion, the chip model XC2V8000-4FF1152C is a powerful and reliable chip model that is expected to be used in various applications and industries in the future. It is designed with the intention to support future upgrades and is likely to be used in advanced communication systems, intelligent scenarios, and the era of fully intelligent systems. It is expected to be able to support new technologies as the needs of the application environment evolve.
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3,483 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,654.7408 | $2,654.7408 |
| 10+ | $2,626.1952 | $26,261.9520 |
| 100+ | $2,483.4672 | $248,346.7200 |
| 1000+ | $2,340.7392 | $1,170,369.6000 |
| 10000+ | $2,140.9200 | $2,140,920.0000 |
| The price is for reference only, please refer to the actual quotation! | ||