AMD Xilinx
XC2V8000-6FFG1152C
XC2V8000-6FFG1152C ECAD Model
XC2V8000-6FFG1152C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 8000000 | |
| Number of CLBs | 11648 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11648 CLBS, 8000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V8000-6FFG1152C Datasheet Download
XC2V8000-6FFG1152C Overview
The XC2V8000-6FFG1152C chip model is a high-performance FPGA device that is suitable for a wide range of digital signal processing, embedded processing, and image processing applications. It is designed to be programmed using the HDL (Hardware Description Language) language, which allows for the development of complex systems with a high degree of control and flexibility.
The XC2V8000-6FFG1152C chip model is part of an industry trend towards higher performance FPGA devices, with the aim of providing more powerful and versatile solutions for a wide range of applications. As technology advances, the application environment may require the support of new technologies, such as the latest networking protocols or advanced AI algorithms.
In order to make the most of the XC2V8000-6FFG1152C chip model, it is important to understand the product description and specific design requirements. This includes an understanding of the device's capabilities, such as its clock speed, memory capacity, and I/O speed. It is also important to consider the actual case studies that have been developed with the device, in order to understand any potential pitfalls or limitations. Finally, it is important to keep up with the latest industry trends and advancements, in order to ensure the best performance from the device.
Overall, the XC2V8000-6FFG1152C chip model is a powerful and versatile solution for a wide range of digital signal processing, embedded processing, and image processing applications. By understanding the product description, design requirements, and case studies, it is possible to make the most of the device and ensure that it meets the needs of the application environment. By keeping up with the latest industry trends and advancements, it is possible to ensure that the device is able to take advantage of the latest technologies, allowing for the development of powerful and effective solutions.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||