AMD Xilinx
XC2V8000-6FF1152I
XC2V8000-6FF1152I ECAD Model
XC2V8000-6FF1152I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 824 | |
| Number of Outputs | 824 | |
| Number of Logic Cells | 104832 | |
| Number of Equivalent Gates | 8000000 | |
| Number of CLBs | 11648 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11648 CLBS, 8000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V8000-6FF1152I Datasheet Download
XC2V8000-6FF1152I Overview
The XC2V8000-6FF1152I chip model is a versatile, high-performance chip designed for a variety of applications, such as digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming, making it accessible to a wide range of users.
The XC2V8000-6FF1152I chip model is an ideal choice for those looking to maximize performance and efficiency in their applications. Its flexibility and scalability make it suitable for a variety of applications, from simple embedded systems to sophisticated digital signal processing and image processing.
The industry trends of the XC2V8000-6FF1152I chip model and the future development of related industries depend on what technologies are needed. As new technologies are developed, the chip model can be adapted to take advantage of them. For example, the chip model could be used to develop and popularize future intelligent robots, as long as the necessary technical talents are available to use the model effectively.
The XC2V8000-6FF1152I chip model is a powerful tool for those looking to create high performance applications. Its flexibility and scalability make it an ideal choice for a variety of applications, and its ability to take advantage of new technologies makes it a great choice for the development and popularization of future intelligent robots. With the right technical talents, the XC2V8000-6FF1152I chip model can be used to create powerful and efficient applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||