
AMD Xilinx
XC2V80-6FG256C
XC2V80-6FG256C ECAD Model
XC2V80-6FG256C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 120 | |
Number of Outputs | 120 | |
Number of Logic Cells | 1152 | |
Number of Equivalent Gates | 80000 | |
Number of CLBs | 128 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 128 CLBS, 80000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC2V80-6FG256C Datasheet Download
XC2V80-6FG256C Overview
The XC2V80-6FG256C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, which makes it an ideal choice for applications that require high performance and accuracy.
The chip model is made up of two main components: the FPGA (Field-Programmable Gate Array) and the CPLD (Complex Programmable Logic Device). The FPGA is used for high-speed processing, while the CPLD is used for low-speed tasks. The combination of these two components allows for a wide range of applications and flexibility.
The XC2V80-6FG256C chip model is a great choice for those looking to develop their own applications. It is capable of performing complex tasks and can be used in a variety of industries, including automotive, aerospace, medical, and consumer electronics.
The chip model is also highly customizable, allowing developers to tailor their applications to their specific needs. It also offers a variety of features, such as high-speed data transfer, secure communication, and low power consumption.
In terms of industry trends, the XC2V80-6FG256C chip model is expected to remain popular in the coming years. As technology advances, new applications and technologies will be developed that will require the use of this chip model.
For those looking to use the XC2V80-6FG256C chip model, it is important to understand the product description and design requirements. Additionally, it is important to consider any potential risks, such as potential compatibility issues with other components. It is also important to consider the actual case studies and precautions to ensure that the application is successful.
Overall, the XC2V80-6FG256C chip model provides a powerful and versatile solution for digital signal processing, embedded processing, and image processing. It is an ideal choice for those looking to develop their own applications, as it offers a wide range of features and flexibility. As technology advances, the XC2V80-6FG256C chip model is expected to remain popular in the coming years, and it is important to understand the product description and design requirements before using it.
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