XC2V80-6FG256C
XC2V80-6FG256C
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rohs

AMD Xilinx

XC2V80-6FG256C


XC2V80-6FG256C
F20-XC2V80-6FG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256
17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256

XC2V80-6FG256C ECAD Model


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XC2V80-6FG256C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 120
Number of Outputs 120
Number of Logic Cells 1152
Number of Equivalent Gates 80000
Number of CLBs 128
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 128 CLBS, 80000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256
Pin Count 256
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2V80-6FG256C Datasheet Download


XC2V80-6FG256C Overview



The XC2V80-6FG256C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, which makes it an ideal choice for applications that require high performance and accuracy.


The chip model is made up of two main components: the FPGA (Field-Programmable Gate Array) and the CPLD (Complex Programmable Logic Device). The FPGA is used for high-speed processing, while the CPLD is used for low-speed tasks. The combination of these two components allows for a wide range of applications and flexibility.


The XC2V80-6FG256C chip model is a great choice for those looking to develop their own applications. It is capable of performing complex tasks and can be used in a variety of industries, including automotive, aerospace, medical, and consumer electronics.


The chip model is also highly customizable, allowing developers to tailor their applications to their specific needs. It also offers a variety of features, such as high-speed data transfer, secure communication, and low power consumption.


In terms of industry trends, the XC2V80-6FG256C chip model is expected to remain popular in the coming years. As technology advances, new applications and technologies will be developed that will require the use of this chip model.


For those looking to use the XC2V80-6FG256C chip model, it is important to understand the product description and design requirements. Additionally, it is important to consider any potential risks, such as potential compatibility issues with other components. It is also important to consider the actual case studies and precautions to ensure that the application is successful.


Overall, the XC2V80-6FG256C chip model provides a powerful and versatile solution for digital signal processing, embedded processing, and image processing. It is an ideal choice for those looking to develop their own applications, as it offers a wide range of features and flexibility. As technology advances, the XC2V80-6FG256C chip model is expected to remain popular in the coming years, and it is important to understand the product description and design requirements before using it.



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