XC2V500-6FG256C
XC2V500-6FG256C
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AMD Xilinx

XC2V500-6FG256C


XC2V500-6FG256C
F20-XC2V500-6FG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256
17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256

XC2V500-6FG256C ECAD Model


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XC2V500-6FG256C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 172
Number of Outputs 172
Number of Logic Cells 6912
Number of Equivalent Gates 500000
Number of CLBs 768
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 768 CLBS, 500000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256
Pin Count 256
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2V500-6FG256C Datasheet Download


XC2V500-6FG256C Overview



The XC2V500-6FG256C chip model is a powerful and versatile FPGA solution for high-performance digital signal processing, embedded processing, and image processing applications. It is a field-programmable gate array (FPGA) device that is designed to be programmed using the hardware description language (HDL) to customize the logic and interconnects of the device. This makes it an ideal choice for customizing a wide range of applications, from low-level embedded systems to complex image processing tasks.


The XC2V500-6FG256C chip model offers several advantages over other FPGA solutions. It has a high-performance architecture that can deliver up to 6.5 Gbps of data throughput. It also has a wide range of I/O options, including LVDS, PCI Express, and Ethernet. Additionally, it has a low power consumption profile, making it suitable for battery-powered applications. The chip model also offers a wide range of configurable logic blocks, allowing for the customization of complex logic designs.


The XC2V500-6FG256C chip model is expected to experience increased demand in the coming years due to its versatile and powerful capabilities. It is already being used in a variety of applications, such as automotive, industrial, consumer electronics, and medical devices. As the demand for these applications increases, the demand for powerful FPGAs like the XC2V500-6FG256C chip model is also expected to increase.


When designing with the XC2V500-6FG256C chip model, there are a few things to keep in mind. First, the design should be optimized for the specific application. This can be done by taking advantage of the configurable logic blocks, I/O options, and high-performance architecture of the chip model. Additionally, the design should be tested thoroughly to ensure that the logic and interconnects are functioning correctly. Finally, the design should be verified to ensure that it meets the application's requirements.


To illustrate the capabilities of the XC2V500-6FG256C chip model, a case study of a medical device is presented. In this case, the chip was used to develop a device that could detect and monitor vital signs from a patient. The device was designed to be low power and efficient, and to provide reliable performance. The design was optimized for the specific application and tested thoroughly to ensure that it met the requirements.


The XC2V500-6FG256C chip model is a powerful and versatile FPGA solution that can be used for a wide range of applications. Its high-performance architecture, wide range of I/O options, and configurable logic blocks make it an ideal choice for customizing complex logic designs. It is expected to experience increased demand in the coming years due to its versatile and powerful capabilities. When designing with the XC2V500-6FG256C chip model, it is important to optimize the design for the specific application, test it thoroughly, and verify that it meets the application's requirements. A case study of a medical device was presented to illustrate the capabilities of the chip model.



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QTY Unit Price Ext Price
1+ $72.5400 $72.5400
10+ $71.7600 $717.6000
100+ $67.8600 $6,786.0000
1000+ $63.9600 $31,980.0000
10000+ $58.5000 $58,500.0000
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