AMD Xilinx
XC2V80-4FG256C
XC2V80-4FG256C ECAD Model
XC2V80-4FG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 120 | |
| Number of Outputs | 120 | |
| Number of Logic Cells | 1152 | |
| Number of Equivalent Gates | 80000 | |
| Number of CLBs | 128 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 128 CLBS, 80000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2V80-4FG256C Datasheet Download
XC2V80-4FG256C Overview
The XC2V80-4FG256C chip model is a powerful and versatile device designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is a Field Programmable Gate Array (FPGA) device that requires the use of HDL (Hardware Description Language) to program and configure the device.
The XC2V80-4FG256C chip model is designed to provide a high-performance, low-power solution for a variety of applications. It features a high-speed logic core with 256 logic cells, two embedded PowerPC processor cores, four high-speed transceivers, and two high-speed MultiGigabit transceivers. The device also includes a variety of memory and I/O options such as DDR2/3, QDR, and SDRAM, as well as a variety of I/O interfaces including USB, Ethernet, and CAN.
The XC2V80-4FG256C chip model is designed for flexibility and scalability. It can be used in a variety of applications, from low-end embedded systems to high-end communication systems. It is also designed with future upgrades in mind, allowing for the addition of new features and capabilities as needed.
When designing with the XC2V80-4FG256C chip model, it is important to consider the specific design requirements of the application. This includes the type of memory and I/O required, the clock speed, the power requirements, and the size of the device. It is also important to consider the cost of the device, as well as the availability of the necessary tools and support.
Case studies can be a useful tool for understanding the capabilities of the XC2V80-4FG256C chip model. For example, a study on a wireless communication system designed with the XC2V80-4FG256C chip model showed that it was able to support high-speed data transfer rates and low power consumption.
When using the XC2V80-4FG256C chip model, it is important to consider the device's limitations. For example, the device is not suitable for applications requiring high-speed data transfer rates or high-power consumption. It is also important to consider the device's power requirements, as it can consume a significant amount of power when running at full capacity.
The XC2V80-4FG256C chip model is a powerful and versatile device that can be used in a variety of applications. It is designed with flexibility and scalability in mind, allowing for the addition of new features and capabilities as needed. However, it is important to consider the specific design requirements of the application, as well as the device's limitations, before using the XC2V80-4FG256C chip model.
You May Also Be Interested In
3,319 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $26.7840 | $26.7840 |
| 10+ | $26.4960 | $264.9600 |
| 100+ | $25.0560 | $2,505.6000 |
| 1000+ | $23.6160 | $11,808.0000 |
| 10000+ | $21.6000 | $21,600.0000 |
| The price is for reference only, please refer to the actual quotation! | ||