XC2V500-6FG256I
XC2V500-6FG256I
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rohs

AMD Xilinx

XC2V500-6FG256I


XC2V500-6FG256I
F20-XC2V500-6FG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256
17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256

XC2V500-6FG256I ECAD Model


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XC2V500-6FG256I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 172
Number of Outputs 172
Number of Logic Cells 6912
Number of Equivalent Gates 500000
Number of CLBs 768
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 768 CLBS, 500000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2V500-6FG256I Datasheet Download


XC2V500-6FG256I Overview



The chip model XC2V500-6FG256I is an integrated circuit designed for use in various applications, such as telecommunications, industrial control, and consumer electronics. It is a high-performance, low-power device that is capable of handling multiple tasks simultaneously. The chip model is based on the Xilinx Virtex-II family of FPGAs, which combines the latest in programmable logic technology with a high degree of flexibility, allowing for a wide range of applications.


As the chip model XC2V500-6FG256I is a relatively new model, the industry trends and future development of related industries are still being determined. However, it is expected that the model will be widely used in many different applications, such as telecommunications, industrial control, and consumer electronics. The model is also expected to be used in the development and popularization of future intelligent robots.


In terms of industry trends, the chip model XC2V500-6FG256I is expected to be widely used in various applications due to its high performance and low power consumption. The model is also expected to be used in the development and popularization of future intelligent robots, as it is capable of handling multiple tasks simultaneously. Furthermore, the model is expected to be used in the development of advanced communication systems, as it is capable of supporting a wide range of applications.


In terms of the original design intention of the chip model XC2V500-6FG256I, it was designed to be used in a wide range of applications, with the intention of providing a high performance and low power device. The model is also expected to be used in the development and popularization of future intelligent robots, as it is capable of handling multiple tasks simultaneously. Furthermore, the model is expected to be used in the development of advanced communication systems, as it is capable of supporting a wide range of applications.


In terms of the future upgrades of the chip model XC2V500-6FG256I, it is expected that the model will be upgraded in order to meet the requirements of the application environment. The model is expected to be upgraded with new technologies, such as advanced communication protocols, artificial intelligence algorithms, and machine learning techniques. Furthermore, the model is expected to be upgraded with new hardware components, such as processors, memory, and storage.


Finally, in terms of the technical talents needed to use the chip model XC2V500-6FG256I effectively, it is expected that the model will require a wide range of technical skills, such as programming, electronics engineering, and machine learning. Furthermore, the model will require a deep understanding of the application environment in order to be used effectively. In addition, the model will require advanced communication protocols, artificial intelligence algorithms, and machine learning techniques in order to be used effectively.



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