
AMD Xilinx
XC2V500-6FG256I
XC2V500-6FG256I ECAD Model
XC2V500-6FG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 172 | |
Number of Outputs | 172 | |
Number of Logic Cells | 6912 | |
Number of Equivalent Gates | 500000 | |
Number of CLBs | 768 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 768 CLBS, 500000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2V500-6FG256I Datasheet Download
XC2V500-6FG256I Overview
The chip model XC2V500-6FG256I is an integrated circuit designed for use in various applications, such as telecommunications, industrial control, and consumer electronics. It is a high-performance, low-power device that is capable of handling multiple tasks simultaneously. The chip model is based on the Xilinx Virtex-II family of FPGAs, which combines the latest in programmable logic technology with a high degree of flexibility, allowing for a wide range of applications.
As the chip model XC2V500-6FG256I is a relatively new model, the industry trends and future development of related industries are still being determined. However, it is expected that the model will be widely used in many different applications, such as telecommunications, industrial control, and consumer electronics. The model is also expected to be used in the development and popularization of future intelligent robots.
In terms of industry trends, the chip model XC2V500-6FG256I is expected to be widely used in various applications due to its high performance and low power consumption. The model is also expected to be used in the development and popularization of future intelligent robots, as it is capable of handling multiple tasks simultaneously. Furthermore, the model is expected to be used in the development of advanced communication systems, as it is capable of supporting a wide range of applications.
In terms of the original design intention of the chip model XC2V500-6FG256I, it was designed to be used in a wide range of applications, with the intention of providing a high performance and low power device. The model is also expected to be used in the development and popularization of future intelligent robots, as it is capable of handling multiple tasks simultaneously. Furthermore, the model is expected to be used in the development of advanced communication systems, as it is capable of supporting a wide range of applications.
In terms of the future upgrades of the chip model XC2V500-6FG256I, it is expected that the model will be upgraded in order to meet the requirements of the application environment. The model is expected to be upgraded with new technologies, such as advanced communication protocols, artificial intelligence algorithms, and machine learning techniques. Furthermore, the model is expected to be upgraded with new hardware components, such as processors, memory, and storage.
Finally, in terms of the technical talents needed to use the chip model XC2V500-6FG256I effectively, it is expected that the model will require a wide range of technical skills, such as programming, electronics engineering, and machine learning. Furthermore, the model will require a deep understanding of the application environment in order to be used effectively. In addition, the model will require advanced communication protocols, artificial intelligence algorithms, and machine learning techniques in order to be used effectively.
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