AMD Xilinx
XC2V6000-6FFG1517I
XC2V6000-6FFG1517I ECAD Model
XC2V6000-6FFG1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V6000-6FFG1517I Datasheet Download
XC2V6000-6FFG1517I Overview
The chip model XC2V6000-6FFG1517I is an advanced integrated circuit developed by Xilinx, Inc. It is a high-performance, low-power FPGA chip with a wide range of applications. It is equipped with a high-speed configuration port, a high-speed I/O port, and a variety of memory resources. It also has a rich set of logic functions, allowing it to be used in various fields.
The chip model XC2V6000-6FFG1517I has a number of advantages. First, its high-speed I/O port allows for the transmission of data at high speeds. This makes it suitable for applications such as video processing, wireless communication, and signal processing. Second, its configuration port allows for easy customization and reconfiguration, making it suitable for a variety of applications. Third, its rich set of logic functions makes it suitable for a wide range of applications, such as embedded systems, digital signal processing, and image processing.
The demand for the chip model XC2V6000-6FFG1517I is expected to continue to grow in the future. This is due to its versatility and its ability to meet the needs of a wide range of applications. It is also expected to be used in a variety of industries, such as automotive, industrial, and consumer electronics.
The original design intention of the chip model XC2V6000-6FFG1517I was to provide a high-performance, low-power FPGA chip that could be used in a variety of applications. It is also possible to upgrade the chip in the future, as new technologies become available. This would allow it to be used in even more advanced applications, such as high-speed communication systems.
The chip model XC2V6000-6FFG1517I can also be used in the development and popularization of future intelligent robots. This is due to its high-speed I/O port and its rich set of logic functions. To use the chip effectively, it is necessary to have a good understanding of the chip’s architecture and its programming language. Additionally, knowledge of computer architecture and embedded systems is required to use the chip in the development of intelligent robots.
In conclusion, the chip model XC2V6000-6FFG1517I is a versatile and powerful FPGA chip with a wide range of applications. It has a number of advantages, such as a high-speed I/O port, a high-speed configuration port, and a rich set of logic functions. Its demand is expected to continue to grow in the future, and it can be used in the development and popularization of future intelligent robots. To use the chip effectively, it is necessary to have a good understanding of the chip’s architecture and its programming language, as well as knowledge of computer architecture and embedded systems.
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