AMD Xilinx
XC2V6000-6FFG1152I
XC2V6000-6FFG1152I ECAD Model
XC2V6000-6FFG1152I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V6000-6FFG1152I Datasheet Download
XC2V6000-6FFG1152I Overview
The XC2V6000-6FFG1152I chip model is a highly advanced model that has been designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a very versatile chip that can be used in a wide range of applications. This chip model requires the use of HDL language, which is a programming language that is used to create and manipulate digital circuits.
The original design intention of the XC2V6000-6FFG1152I chip model was to provide a versatile and powerful solution for digital signal processing, embedded processing, and image processing. The chip model is capable of being used in advanced communication systems and can be easily upgraded to meet the changing needs of the user. This chip model is also capable of being used in the development and popularization of future intelligent robots.
In order to use the XC2V6000-6FFG1152I chip model effectively, it is important to have the right technical talent. This chip model requires a strong understanding of HDL language, as well as a good grasp of digital signal processing, embedded processing, and image processing. It is also beneficial to have a good understanding of communication systems and robotics in order to be able to use the chip model to its fullest potential.
Overall, the XC2V6000-6FFG1152I chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It can also be used in advanced communication systems and in the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to have the right technical talent and a strong understanding of the HDL language.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||