AMD Xilinx
XC2V6000-6FF1517I
XC2V6000-6FF1517I ECAD Model
XC2V6000-6FF1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 1104 | |
| Number of Outputs | 1104 | |
| Number of Logic Cells | 76032 | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V6000-6FF1517I Datasheet Download
XC2V6000-6FF1517I Overview
The XC2V6000-6FF1517I chip model is an advanced, highly integrated, and cost-effective field programmable gate array (FPGA) designed for high-performance digital signal processing, embedded processing, and image processing applications. It is capable of running code written in the HDL language, making it well-suited for a variety of applications.
As technology continues to advance, the XC2V6000-6FF1517I chip model may be used in a variety of new and innovative ways. In the near future, it may be used in networks and intelligent scenarios, such as machine learning, artificial intelligence, and automated decision-making. It may also be used in fully intelligent systems, such as self-driving cars, autonomous robots, and smart home systems.
The XC2V6000-6FF1517I chip model is well-suited for a variety of applications, from small-scale embedded systems to large-scale data processing. It is capable of handling large amounts of data quickly and accurately, making it an ideal choice for a variety of applications. As technology continues to evolve, the XC2V6000-6FF1517I chip model may be used in a variety of new and innovative ways.
The XC2V6000-6FF1517I chip model is a powerful and versatile tool that can be used in a variety of applications. It is capable of running code written in the HDL language, making it well-suited for a variety of applications. It is also capable of handling large amounts of data quickly and accurately, making it an ideal choice for a variety of applications. As technology continues to evolve, the XC2V6000-6FF1517I chip model may be used in a variety of new and innovative ways. It may be used in networks and intelligent scenarios, such as machine learning, artificial intelligence, and automated decision-making. It may also be used in fully intelligent systems, such as self-driving cars, autonomous robots, and smart home systems.
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|---|---|---|
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