AMD Xilinx
XC2V6000-6FF1152I
XC2V6000-6FF1152I ECAD Model
XC2V6000-6FF1152I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 824 | |
| Number of Outputs | 824 | |
| Number of Logic Cells | 76032 | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V6000-6FF1152I Datasheet Download
XC2V6000-6FF1152I Overview
The XC2V6000-6FF1152I chip model is a product of Xilinx, a leading provider of programmable logic solutions. It is designed to meet the demands of a variety of applications in the communications, networking and industrial control markets. This chip model offers a wide range of advantages that make it an ideal choice for a variety of applications.
The XC2V6000-6FF1152I chip model is a high-performance, low-power device that integrates a variety of features and functions. It is a high-end, high-performance device that is designed to meet the needs of a wide range of applications. The chip model has a variety of features, including a high-speed, low-power processor core, high-speed, low-power memory, and a variety of peripherals. The chip model also features a wide range of I/O interfaces, including Ethernet, USB, and Serial. This makes the chip model an ideal choice for a variety of applications.
The XC2V6000-6FF1152I chip model is designed to meet the needs of a variety of applications, including industrial control, networking, communications, and embedded systems. The chip model is designed to be highly customizable and can be used in a variety of applications. The chip model is also designed to be used in a variety of intelligent scenarios, including machine learning and artificial intelligence. The chip model is designed to be highly scalable and can be used in a variety of networks, including 4G and 5G networks.
The XC2V6000-6FF1152I chip model is designed for use in the era of fully intelligent systems. It is designed to be highly customizable and can be used in a variety of applications, including machine learning and artificial intelligence. The chip model is designed to be highly scalable and can be used in a variety of networks, including 4G and 5G networks. The chip model is also designed to be used in a variety of intelligent scenarios, including autonomous driving and smart home applications.
The XC2V6000-6FF1152I chip model is expected to be in high demand in the future, due to its wide range of features and applications. It is expected to be used in a variety of applications, including industrial control, networking, communications, and embedded systems. The chip model is also expected to be used in a variety of intelligent scenarios, including machine learning and artificial intelligence. The chip model is also expected to be used in a variety of networks, including 4G and 5G networks.
The XC2V6000-6FF1152I chip model is designed to be highly customizable and can be upgraded to meet the needs of future applications. The chip model is designed to be highly scalable and can be used in a variety of networks, including 4G and 5G networks. The chip model is also designed to be used in a variety of intelligent scenarios, including autonomous driving and smart home applications. The chip model is also designed to be used in a variety of networks, including 4G and 5G networks.
In conclusion, the XC2V6000-6FF1152I chip model is an ideal choice for a variety of applications. It is designed to be highly customizable and can be upgraded to meet the needs of future applications. It is also designed to be highly scalable and can be used in a variety of networks, including 4G and 5G networks. The chip model is also designed to be used in a variety of intelligent scenarios, including machine learning and artificial intelligence. The chip model is expected to be in high demand in the future, due to its wide range of features and applications.
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3,694 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,103.3088 | $4,103.3088 |
| 10+ | $4,059.1872 | $40,591.8720 |
| 100+ | $3,838.5792 | $383,857.9200 |
| 1000+ | $3,617.9712 | $1,808,985.6000 |
| 10000+ | $3,309.1200 | $3,309,120.0000 |
| The price is for reference only, please refer to the actual quotation! | ||