
AMD Xilinx
XC2V6000-6FF1152C
XC2V6000-6FF1152C ECAD Model
XC2V6000-6FF1152C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 824 | |
Number of Outputs | 824 | |
Number of Logic Cells | 76032 | |
Number of Equivalent Gates | 6000000 | |
Number of CLBs | 8448 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8448 CLBS, 6000000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
Pin Count | 1152 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC2V6000-6FF1152C Datasheet Download
XC2V6000-6FF1152C Overview
The XC2V6000-6FF1152C chip model is an advanced FPGA (Field Programmable Gate Array) designed for high performance digital signal processing, embedded processing, image processing and other applications. It is designed to be programmed using a hardware description language (HDL) such as Verilog or VHDL.
The original design intention of the XC2V6000-6FF1152C chip model was to provide a powerful and flexible platform for a wide range of applications. The chip model is capable of handling large amounts of data with high speed and accuracy, making it suitable for a variety of tasks such as image processing, embedded system design, and digital signal processing. The chip model also offers the possibility of future upgrades, allowing users to upgrade their hardware without having to replace the entire system.
The XC2V6000-6FF1152C chip model is designed to meet specific design requirements. It features a high-speed, low-power architecture and advanced features such as built-in memory controllers, clock management, and configurable logic blocks. The chip model also has built-in support for advanced communication systems such as Ethernet, Wi-Fi, and Bluetooth.
When designing a system with the XC2V6000-6FF1152C chip model, it is important to consider the specific requirements of the system. This includes the type of data to be processed, the speed of the system, and the power requirements. Additionally, it is important to consider the specific design requirements of the chip model, such as the number of logic blocks and memory controllers, as well as any special features such as support for advanced communication systems.
To demonstrate the capabilities of the XC2V6000-6FF1152C chip model, there are a number of case studies that have been conducted. These case studies provide detailed information about the performance of the chip model in various applications and scenarios. Additionally, these case studies provide valuable insight into the design requirements of the chip model and the potential for future upgrades.
When using the XC2V6000-6FF1152C chip model, it is important to take all necessary precautions to ensure the safety and reliability of the system. This includes proper installation, maintenance, and testing of the system. Additionally, it is important to ensure that the chip model is compatible with the specific hardware and software required for the system.
The XC2V6000-6FF1152C chip model is a powerful and flexible FPGA designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be programmed using a hardware description language (HDL) such as Verilog or VHDL. The chip model is capable of handling large amounts of data with high speed and accuracy, and offers the possibility of future upgrades. When designing a system with the XC2V6000-6FF1152C chip model, it is important to consider the specific requirements of the system, as well as the design requirements of the chip model and any special features such as support for advanced communication systems. Additionally, it is important to take all necessary precautions to ensure the safety and reliability of the system.
You May Also Be Interested In
5,978 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,103.3088 | $4,103.3088 |
10+ | $4,059.1872 | $40,591.8720 |
100+ | $3,838.5792 | $383,857.9200 |
1000+ | $3,617.9712 | $1,808,985.6000 |
10000+ | $3,309.1200 | $3,309,120.0000 |
The price is for reference only, please refer to the actual quotation! |