XC2V6000-6FF1152C
XC2V6000-6FF1152C
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rohs

AMD Xilinx

XC2V6000-6FF1152C


XC2V6000-6FF1152C
F20-XC2V6000-6FF1152C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152

XC2V6000-6FF1152C ECAD Model


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XC2V6000-6FF1152C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 824
Number of Outputs 824
Number of Logic Cells 76032
Number of Equivalent Gates 6000000
Number of CLBs 8448
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 8448 CLBS, 6000000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
Pin Count 1152
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC2V6000-6FF1152C Datasheet Download


XC2V6000-6FF1152C Overview



The XC2V6000-6FF1152C chip model is an advanced FPGA (Field Programmable Gate Array) designed for high performance digital signal processing, embedded processing, image processing and other applications. It is designed to be programmed using a hardware description language (HDL) such as Verilog or VHDL.


The original design intention of the XC2V6000-6FF1152C chip model was to provide a powerful and flexible platform for a wide range of applications. The chip model is capable of handling large amounts of data with high speed and accuracy, making it suitable for a variety of tasks such as image processing, embedded system design, and digital signal processing. The chip model also offers the possibility of future upgrades, allowing users to upgrade their hardware without having to replace the entire system.


The XC2V6000-6FF1152C chip model is designed to meet specific design requirements. It features a high-speed, low-power architecture and advanced features such as built-in memory controllers, clock management, and configurable logic blocks. The chip model also has built-in support for advanced communication systems such as Ethernet, Wi-Fi, and Bluetooth.


When designing a system with the XC2V6000-6FF1152C chip model, it is important to consider the specific requirements of the system. This includes the type of data to be processed, the speed of the system, and the power requirements. Additionally, it is important to consider the specific design requirements of the chip model, such as the number of logic blocks and memory controllers, as well as any special features such as support for advanced communication systems.


To demonstrate the capabilities of the XC2V6000-6FF1152C chip model, there are a number of case studies that have been conducted. These case studies provide detailed information about the performance of the chip model in various applications and scenarios. Additionally, these case studies provide valuable insight into the design requirements of the chip model and the potential for future upgrades.


When using the XC2V6000-6FF1152C chip model, it is important to take all necessary precautions to ensure the safety and reliability of the system. This includes proper installation, maintenance, and testing of the system. Additionally, it is important to ensure that the chip model is compatible with the specific hardware and software required for the system.


The XC2V6000-6FF1152C chip model is a powerful and flexible FPGA designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be programmed using a hardware description language (HDL) such as Verilog or VHDL. The chip model is capable of handling large amounts of data with high speed and accuracy, and offers the possibility of future upgrades. When designing a system with the XC2V6000-6FF1152C chip model, it is important to consider the specific requirements of the system, as well as the design requirements of the chip model and any special features such as support for advanced communication systems. Additionally, it is important to take all necessary precautions to ensure the safety and reliability of the system.



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Unit Price: $4,412.16
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,103.3088 $4,103.3088
10+ $4,059.1872 $40,591.8720
100+ $3,838.5792 $383,857.9200
1000+ $3,617.9712 $1,808,985.6000
10000+ $3,309.1200 $3,309,120.0000
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