
AMD Xilinx
XC2V6000-5FF1152C
XC2V6000-5FF1152C ECAD Model
XC2V6000-5FF1152C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 824 | |
Number of Outputs | 824 | |
Number of Logic Cells | 76032 | |
Number of Equivalent Gates | 6000000 | |
Number of CLBs | 8448 | |
Combinatorial Delay of a CLB-Max | 390 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8448 CLBS, 6000000 GATES | |
Clock Frequency-Max | 750 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
Pin Count | 1152 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC2V6000-5FF1152C Datasheet Download
XC2V6000-5FF1152C Overview
The chip model XC2V6000-5FF1152C is a powerful and reliable model that has been used in many industries and applications. It is one of the most popular chip models in the market and is widely used in many applications such as networking, data processing, and embedded systems. In terms of industry trends, the chip model XC2V6000-5FF1152C is expected to continue to be used in many applications in the future.
The chip model XC2V6000-5FF1152C is capable of providing the necessary support for many new technologies in the future. It can be used in networks to provide the necessary support for intelligent scenarios, such as the Internet of Things, artificial intelligence, and machine learning. It can also be used in the development and popularization of future intelligent robots, as it is capable of providing the necessary support for the development of advanced robotic systems.
In terms of technical talents needed for using the chip model XC2V6000-5FF1152C effectively, it is important to have a good understanding of the chip model and its applications. Knowledge of embedded systems, networking, and data processing is also essential. Additionally, having a good understanding of the technologies used in the development of intelligent robots and the Internet of Things is also important.
In conclusion, the chip model XC2V6000-5FF1152C is a powerful and reliable model that is expected to be used in many applications in the future. It is capable of providing the necessary support for many new technologies, such as the Internet of Things, artificial intelligence, and machine learning. It can also be used in the development and popularization of future intelligent robots. To use the model effectively, it is important to have a good understanding of the chip model and its applications, as well as the technologies used in the development of intelligent robots and the Internet of Things.
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1,112 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,934.4000 | $1,934.4000 |
10+ | $1,913.6000 | $19,136.0000 |
100+ | $1,809.6000 | $180,960.0000 |
1000+ | $1,705.6000 | $852,800.0000 |
10000+ | $1,560.0000 | $1,560,000.0000 |
The price is for reference only, please refer to the actual quotation! |