XC2V6000-4FF1517C
XC2V6000-4FF1517C
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rohs

AMD Xilinx

XC2V6000-4FF1517C


XC2V6000-4FF1517C
F20-XC2V6000-4FF1517C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517
40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517

XC2V6000-4FF1517C ECAD Model


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XC2V6000-4FF1517C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 1104
Number of Outputs 1104
Number of Logic Cells 76032
Number of Equivalent Gates 6000000
Number of CLBs 8448
Combinatorial Delay of a CLB-Max 440 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 8448 CLBS, 6000000 GATES
Clock Frequency-Max 650 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517
Pin Count 1517
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A001.A.7.A

XC2V6000-4FF1517C Datasheet Download


XC2V6000-4FF1517C Overview



The XC2V6000-4FF1517C chip model is an advanced digital signal processor designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be programmed using the HDL language, allowing for greater flexibility and scalability. The XC2V6000-4FF1517C chip model is designed for a wide range of applications, from basic data processing to complex tasks such as image recognition, artificial intelligence, and advanced communication systems.


The original design intention of the XC2V6000-4FF1517C chip model was to provide a high-performance, low-power solution for digital signal processing applications. Its scalability and flexibility make it suitable for use in a variety of scenarios, from basic data processing to complex tasks. It has the capability to be upgraded to support more advanced features and applications, such as artificial intelligence and advanced communication systems.


The XC2V6000-4FF1517C chip model is also suitable for use in networks and intelligent scenarios. It has the capability to be used in fully intelligent systems, such as autonomous vehicles, robotics, and smart homes. In these scenarios, the XC2V6000-4FF1517C chip model can be used to process and analyze data from sensors, allowing for more efficient and accurate decision-making. It can also be used for data encryption, ensuring secure communication between devices.


In conclusion, the XC2V6000-4FF1517C chip model is designed for high-performance digital signal processing, embedded processing, and image processing applications. Its scalability and flexibility make it suitable for use in a variety of scenarios, from basic data processing to complex tasks such as image recognition, artificial intelligence, and advanced communication systems. Furthermore, it has the capability to be used in networks and intelligent scenarios, allowing for more efficient and secure communication between devices.



3,559 In Stock


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Unit Price: $1,500.00
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,395.0000 $1,395.0000
10+ $1,380.0000 $13,800.0000
100+ $1,305.0000 $130,500.0000
1000+ $1,230.0000 $615,000.0000
10000+ $1,125.0000 $1,125,000.0000
The price is for reference only, please refer to the actual quotation!

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