
AMD Xilinx
XC2V6000-4FF1517C
XC2V6000-4FF1517C ECAD Model
XC2V6000-4FF1517C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 1104 | |
Number of Outputs | 1104 | |
Number of Logic Cells | 76032 | |
Number of Equivalent Gates | 6000000 | |
Number of CLBs | 8448 | |
Combinatorial Delay of a CLB-Max | 440 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8448 CLBS, 6000000 GATES | |
Clock Frequency-Max | 650 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
Pin Count | 1517 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.7.A |
XC2V6000-4FF1517C Datasheet Download
XC2V6000-4FF1517C Overview
The XC2V6000-4FF1517C chip model is an advanced digital signal processor designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be programmed using the HDL language, allowing for greater flexibility and scalability. The XC2V6000-4FF1517C chip model is designed for a wide range of applications, from basic data processing to complex tasks such as image recognition, artificial intelligence, and advanced communication systems.
The original design intention of the XC2V6000-4FF1517C chip model was to provide a high-performance, low-power solution for digital signal processing applications. Its scalability and flexibility make it suitable for use in a variety of scenarios, from basic data processing to complex tasks. It has the capability to be upgraded to support more advanced features and applications, such as artificial intelligence and advanced communication systems.
The XC2V6000-4FF1517C chip model is also suitable for use in networks and intelligent scenarios. It has the capability to be used in fully intelligent systems, such as autonomous vehicles, robotics, and smart homes. In these scenarios, the XC2V6000-4FF1517C chip model can be used to process and analyze data from sensors, allowing for more efficient and accurate decision-making. It can also be used for data encryption, ensuring secure communication between devices.
In conclusion, the XC2V6000-4FF1517C chip model is designed for high-performance digital signal processing, embedded processing, and image processing applications. Its scalability and flexibility make it suitable for use in a variety of scenarios, from basic data processing to complex tasks such as image recognition, artificial intelligence, and advanced communication systems. Furthermore, it has the capability to be used in networks and intelligent scenarios, allowing for more efficient and secure communication between devices.
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3,559 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,395.0000 | $1,395.0000 |
10+ | $1,380.0000 | $13,800.0000 |
100+ | $1,305.0000 | $130,500.0000 |
1000+ | $1,230.0000 | $615,000.0000 |
10000+ | $1,125.0000 | $1,125,000.0000 |
The price is for reference only, please refer to the actual quotation! |